Electronics Forum | Tue Feb 03 03:57:37 EST 2009 | sachu_70
Hi George, I would suggest you to re-look your process parameters, especially for the pre-heat temperatures and the amount of flux deposited. The mask properties and that of your flux also play a role, but you could zero down to the root cause after
Electronics Forum | Thu Apr 20 05:35:25 EDT 2000 | Keith Stone
Hi Pete We have a Black and Decker Power File and have mounted it on a bench in an enclosure to capture the hazardous dust. We used a hopper (usually used for guttering!) with a wire mesh over the top (static reasons) mounted in the bench top inside
Electronics Forum | Tue Jul 01 17:38:24 EDT 2003 | jartman
I've faced this several times in the past, and the only real solution is to wirebond before SMT assembly. Everything leaves a residue, and trying to clean a residue off later is basically hopeless. This may require some trickery in your SMT process
Electronics Forum | Wed Sep 30 13:54:00 EDT 1998 | Chrys
All y'all | | BACKGROUND. How many times do you see folks come to work all painted-up and then by the time first break comes, the lipstick, eye liner, and who knows what else are gone and they�re heading for the facilities to "freshen-up." I w
Electronics Forum | Fri Oct 02 16:52:38 EDT 1998 | Dave F
All y'all | | | | | BACKGROUND. How many times do you see folks come to work all painted-up and then by the time first break comes, the lipstick, eye liner, and who knows what else are gone and they�re heading for the facilities to "freshen-up."
Electronics Forum | Fri Jul 06 03:23:01 EDT 2001 | kennyhktan
Hi there Steven ! Please allow me to share some of my problem we're facing here with you. Here are a few points that I suggest you should check on your current process:- (1)PCB - Component land partern design ? It is per IPC spec ? - Mask
Electronics Forum | Wed Apr 21 19:09:10 EDT 1999 | Earl Moon
| | Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proc
Electronics Forum | Mon Dec 30 23:37:47 EST 2019 | agoesfirmanto
Hello All, I am a SMT Engineer from Indonesia, I am facing the problem of soldering balls in only one IC location, in other areas there are none. solder ball defect almost 30%. I have done several actions but failed to reduce the solder ball. 1.
Electronics Forum | Wed Dec 09 10:02:10 EST 1998 | Earl Moon
| Does anybody out there have any special insights into utilizing no clean paste in high frequency RF applications? I would imagine there may be some issues with solder balls that would affect functional test (Earl, do you have something for me here?
Electronics Forum | Thu Jun 03 07:10:31 EDT 1999 | Earl Moon
| | To you all for comment and summary, | | | | The following things I like without endorsing (PCB/PCBA stuff - outside the great women in my life [many] and without [mostly]): | | | | 1) A good set of design rules | | 2) A good set of design rules
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