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Industry 4.0: Mining Physical Defects in Production of Surface-Mount Devices

Technical Library | 2021-12-02 01:44:00.0

With the advent of Industry 4.0, production processes have been endowed with intelligent cyber-physical systems generating massive amounts of streaming sensor data. Internet of Things technologies have enabled capturing, managing, and processing production data at a large scale in order to utilize this data as an asset for the optimization of production processes. In this work, we focus on the automatic detection of physical defects in the production of surfacemount devices. We show how to build a classification model based on random forests that efficiently detects defect products with a high degree of precision. In fact, the results of our preliminary experimental analysis indicate that our approach is able to correctly determine defects in a simulated production environment of surface-mount devices with a MCC score of 0.96. We investigate the feasibility of utilizing this approach in realistic settings. We believe that our approach will help to advance the production of surface-mount devices.

Fraunhofer Institute for Applied Information Technology

Drying printed circuit boards

Technical Library | 2024-01-08 18:36:01.0

The following aims lie behind the investigations described: The circuit board is an integrated structure made of metal and plastic. Like most integrated components enclosed in plastic, it absorbs water. When it is rapidly heated as, for example, in soldering technology temperature processes, it is a well known fact that the water will evaporate abruptly, leading to destruction. It is therefore essential that the circuit board be dried before these soldering processes. Circuit board manufacturers are extremely hesitant at providing instructions on drying their circuit boards. Information from the ZVEI [1] should also be regarded critically. The cardinal problem is the high temperature which is recommended for baking. If this is applied, the result is often de-lamination and distortion of the circuit boards. Corrosion and the formation of intermetallic phases of the metallic surfaces are also to be expected. The following investigates whether gentle drying at 45°C or 60°C and at low relative humidity achieves the same result as baking at high temperatures. The industry provides novel dry cabinets which are suitable for rapid drying at relative humidities below one percent.

TOTECH Canada N.A Inc

Component Reliability After Long Term Storage

Technical Library | 2024-06-19 15:23:54.0

Each year the semiconductor industry routes a significant volume of devices to recycling sites for no reliability or quality rationale beyond the fact that those devices were stored on a warehouse shelf for two years. This study identifies the key risks attributed to extended storage of devices in uncontrolled indoor environments and the risk mitigation required to permit safe shelf-life extension. Component reliability was evaluated after extended storage to assure component solderability, MSL stability and die surface integrity. Packing materials were evaluated for customer use parameters as well as structural integrity and ESD properties. Results show that current packaging material (mold compound and leadframe) is sufficiently robust to protect the active integrated circuits for many decades and permit standard reflow solder assembly beyond 15 years. Standard packing materials (bags, desiccant, and humidity cards) are robust for a 32 month storage period that can be extended by repacking with fresh materials. Packing materials designed for long term storage are effective for more than five years.

Texas Instruments

Rohde & Schwarz SMU200A-B10-B13-B14-B15-B16-B17-B31-B90-B106-B203-K40-K41-K62

Rohde & Schwarz SMU200A-B10-B13-B14-B15-B16-B17-B31-B90-B106-B203-K40-K41-K62

Used SMT Equipment | In-Circuit Testers

Rohde & Schwarz SMU200A-B10-B13-B14-B15-B16-B17-B31-B90-B106-B203-K40-K41-K62 Rohde Schwarz SMU200A/ B10/B13/B14/B15/B16/B17/B31/B90/B106/B203/K40/K41/K62 The R&S SMU200A Vector Signal Generator not only combines up to two independent signal ge

Test Equipment Connection

XMatic - CAD Translation Software

XMatic - CAD Translation Software

New Equipment | Software

Flexible data preparation The XMatic software is a modular tool to provide the maximum flexibility to generate equipment data. The Concept is based on the fact that the data extracted from the CAD is invariably incorrent, incomplete or missing. The

Acculogic Inc.

MTS 180 Eagle - ICT Test System with Low Cost Fixturing Solution

MTS 180 Eagle - ICT Test System with Low Cost Fixturing Solution

New Equipment | Test Equipment

Press-Down-Unit (PDU) Fixturing system provides lowest cost interface.  Combining Economics & Quality in PCB Test Non-Multiplexed to 3,456 pins One Touch Fixture Interface provides fastest change-over times (1,400 nets) Fast Test Program Gene

Digitaltest Inc.

ACS 1100 Intelligent Automatic Storage System for SMD

ACS 1100 Intelligent Automatic Storage System for SMD

New Equipment | Board Handling - Storage

The ACS1100 intelligent automatic warehouse for SMD coils has been specially designed and made to achieve an optimum performance as regards storage capacity and total size. With a maximum total capacity of 1100 reels, the ACS1100 is the optimum sol

StorageSolutions

This animation shows the overview of programming and running of a MYDATA MY500 Jet Printing machine.

This animation shows the overview of programming and running of a MYDATA MY500 Jet Printing machine.

Videos

This animation shows the overview of programming and running of a MYDATA MY500 Jet Printing machine. Check the ''Jet Printing in detail'' video to see how Jet Printing works

Mycronic Technologies AB

As solder costs soar, manufacturers benefit from a quick ROI, reusing solder taken directly off their wave and processed on site in this safe, mobile, user-friendly system.

As solder costs soar, manufacturers benefit from a quick ROI, reusing solder taken directly off their wave and processed on site in this safe, mobile, user-friendly system.

Videos

The EVS Solder Recovery system recylces solder form dross using no chemicals or additives, on site, in an efficient, easy process. As solder costs soar, manufacturers benefit from a quick ROI, reusing solder taken directly off their wave and processe

EVS International

Hirox RH-2000 - next generation digital microscopy

Hirox RH-2000 - next generation digital microscopy

Videos

Discover the RH-2000 from Hirox! More information: - www.hirox-europe.com - www.hirox.com - www.hirox-usa.com

Seika Machinery, Inc.


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