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Re: Solder Connection Environmental Screening

Electronics Forum | Wed Aug 23 16:18:47 EDT 2000 | Dr. Ning-Cheng Lee

I presume you are referring to vibration test with fixed frequency at room temperature. One procedure describing the detailed profile is in MIL-STD-883E, Method 2005.2 (12/31/96). The approximate profile can be described as 60Hz, 20-70g, and 96 hrs t

Re: Conversion to no-clean solder paste

Electronics Forum | Tue Jan 25 13:06:47 EST 2000 | Bill Schreiber

When switching from cleaning RMA to a no-clean flux, one area that is commonly overlooked is the stencil cleaning operation. Stencil cleaners that are effective in cleaning RMA often fail when cleaning no-clean (especially alcohol cleaners). Pallet

Pin in hole process problem

Electronics Forum | Tue Jul 28 14:34:47 EDT 1998 | upinder singh

Hello everybody. Remember I posted some questions on the smtnet regarding placing the thru hole connector using paste and reflow(pin in hole). I have able to accomplish the process succcesfully.....but I have a problem. The boards are failing at the

Re: SMTECH Sigmaprint 500

Electronics Forum | Wed Apr 15 13:47:17 EDT 1998 | kend

I have 2 and am generally pleased with them. 1 machine has performed perfectly without fail, while the other has had a number of problems. The problematic machine was once a demo and probably took alot of abuse before we got it. Easily a 16 mil pit

BGA open joint

Electronics Forum | Thu Aug 05 21:47:35 EDT 2004 | KEN

Agreed. Joint failure can happen when un-bagging or durig box-build (at customer site). Careful handling should be used. In one case I had boards returned to me for evaluation and failure analysis. Too bad our site never built the boards!!! (jacka

Ultrasonic washing for boards

Electronics Forum | Mon Apr 25 14:23:47 EDT 2005 | carln

Mike Conrad's "matter of full disclosure" is not quite complete. He fails to mention that he only makes spray-in-air board cleaners and only ultrasonic stencil cleaners. He does not make ultrasonic board cleaners. So, he apparently he is "grinding

Do you need to bake after parts are in the Dry Cabinet

Electronics Forum | Thu Jan 26 14:47:46 EST 2006 | james

Just wondering what others are doing as far MSD parts. We keep most of our parts in the dry cabinet before use. Most bags are openend and have passed the recomendation as far as mounting within a certain time. We have had defects with boards that

Do you need to bake after parts are in the Dry Cabinet

Electronics Forum | Wed Feb 01 11:47:07 EST 2006 | Mike

James, If you have a true MSD issue, then baking them AFTER your reflow is not going to fix the issue. I would have to agree with GS and look at trapped cleaner media (if your not No-clean) under the components, or inside connectors. If your runnin

FR-4 IN ROHS applications

Electronics Forum | Thu Apr 26 16:47:52 EDT 2007 | Cmiller

Is anyone using standard FR-4 material for ROHS? All I have ever seen to indicate the need to go to a high tg/td board is that the material may fail after repeted rework. I have a customer that is trying to use IS-410 and it is causing electrical pro

Researching stencil cleaners

Electronics Forum | Tue Mar 27 17:47:04 EST 2001 | kerryn

The Smart Sonic 440-R SMT detergent is certified safe and effective by the EPA (I downloaded the documents from their web site). Is this true of the other chemistries that you referenced? If so, where can I find the documentation? If not, why not?


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