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Re: First Article

Electronics Forum | Thu Oct 07 13:47:19 EDT 1999 | Doug Philbrick

| Our first article inspection after machine placement can take several hours depending on the complexity of the board. The operator visually checks the board against the drawing and bill of material. I'd be interested to hear if there are any other

SOIC FAIL

Electronics Forum | Tue Oct 26 13:40:47 EDT 2004 | Paul_pmd

Have the SOIC tested by independant. Clarify as to weather or not you have run this board before. Check to see if the board has been rev'ed. Sometimes IC's are rated at a clock speed or by axcess time. Engneering on this board may be at the tolorance

Business question for you CMers

Electronics Forum | Thu May 18 12:37:47 EDT 2006 | slthomas

I can't believe this is the first time this has happened, but anyway..... We have a turnkey job (customer provided only the bare boards) that included testing with their system. One board failed, and we found damage (a short deep gouge) that seems t

Chemical Reations

Electronics Forum | Fri Jun 22 13:47:51 EDT 2007 | 18424

Good afternoon all, I am looking for help from you folks to find a place that can do metalurgical analysis on components and contamination. We are an OEM and just recently received back from the customer several units that failed in the field after

BGA Voids

Electronics Forum | Wed Feb 13 09:17:47 EST 2008 | scottp

The causes of voids are extremely paste dependent. I did a literature search a couple years ago and the papers all disagreed with each other - one would say turn knob "A" to the right and the next would tell you to turn it to the left. I did my own

Solder Pot Volume reducers

Electronics Forum | Thu Nov 13 17:47:00 EST 2014 | warwolf

could always use a potato? http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=9994&#Message56920 But seriously.. best idea is to stay away from any metal as the tin will likely dissolve and contaminate your solder pot.

solder ball

Electronics Forum | Mon Dec 30 23:37:47 EST 2019 | agoesfirmanto

Hello All, I am a SMT Engineer from Indonesia, I am facing the problem of soldering balls in only one IC location, in other areas there are none. solder ball defect almost 30%. I have done several actions but failed to reduce the solder ball. 1.

Re: Transient Voltage Suppressors

Electronics Forum | Tue Mar 16 05:11:47 EST 1999 | Charles Stringer

| | AVX and a few other companies make these chip transient voltage suppressors (TVS) parts that are a real *PAIN* to use. According to AVX: | | "Due to the semiconducting nature of the doped Zinc Oxide (ZnO) ceramic material, SMT TransGuard

MPM UP2000 Hardware Limit

Electronics Forum | Fri Mar 29 16:17:47 EDT 2013 | aemery

Sorry I am late on this thread, just became a member and was scanning through the posts. I am a former FSE for Speedline, now independant, so all this stuff is my bread and butter. Here are some facts that could help you all in the future. MPM pri

Re: Bridge on BGA

Electronics Forum | Fri Aug 20 14:51:47 EDT 1999 | Tony

| | | Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. | | | | | | This is what I did. | | | | | | Created a


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