New Equipment | Test Equipment
The TherMoiré® PS200S is a metrology solution that utilizes the shadow moiré measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for samples up to 150 mm x 200 mm. With time-temperature profiling cap
Electronics Forum | Tue Oct 25 15:03:48 EDT 2011 | sjs2303
Hi Bert, For your second issue, are the tools well lubricated? If not the Midas head can fail to grab the tool and can generate the z motor error. Doing this followed by a base-centre level measurement should resolve your problem. Steve
Electronics Forum | Mon Mar 03 11:06:13 EST 2003 | msivigny
Hi floydl, I completely understand when it comes to data crunching after long hours of performing measurements, it's the last and most important arduous task in obtaining performance data. If a measurement and evaluation process that traditionally to
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2021-12-08 20:48:30.0
With the development of motor technology, compressor is considered as "general machinery", especially in coal chemical industry, machinery industry and other industries. For distance measurement applications, both incremental and absolute encoders can be chosen - from a technical point of view. The advantages of absolute encoders are reflected in accuracy and performance, while incremental encoders seem more economical and practical. A correctly working compressor determines the safe operation of the whole air conditioner or refrigerator. For example, during the operation of piston compressor, there would be burnout, oiler failure or low pressure and gas shortage. Once these problems occur, the appliance would not work right. How to quickly and accurately detect and solve these problems in time affects the compressor operating rate and product output. This article will analyze all common faults of AC compressors and provide solutions.
Technical Library | 2014-08-19 16:04:28.0
SMT assembly planning and failure analysis of surface mount assembly defects often include component warpage evaluation. Coplanarity values of Integrated Circuit packages have traditionally been used to establish pass/fail limits. As surface mount components become smaller, with denser interconnect arrays, and processes such package-on-package assembly become prevalent, advanced methods using dual surface full-field data become critical for effective Assembly Planning, Quality Assurance, and Failure Analysis. A more complete approach than just measuring the coplanarity of the package is needed. Analyzing the gap between two surfaces that are constantly changing during the reflow thermal cycle is required, to effectively address the challenges of modern SMT assembly.
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/divisions/test-and-inspection?page=2
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ASCEN Technology | https://www.ascen.ltd/Blog/Gif/603.html
. Instrument by color CCD camera, zoom objective and generator as measuring aiming system; 3. Grating feet and DC - 3000 electricity box composition digital measurement and data processing system; 4. The vision measurement
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