Industry News | 2017-01-29 09:37:08.0
TopLine will exhibit its MSC Series of Micro-coil springs, a novel interconnect for CCGA (Ceramic Column Grid Array) IC packages for harsh environments. In tests using daisy chain test vehicles, Micro-coil springs absorbed extreme shock of up to 50,000g before failing. Commercial applications include aerospace, avionics, military, down-hole oilfield drilling and automotive electronics. Test results were initially presented at IEEE CPMT 2012.
Industry News | 2021-05-10 02:50:10.0
BSU Inc. has updated its high-performance X-ray inspection capability with the installation of a Nikon XT V Series world-class X-ray and CT inspection system. In addition to inspecting many areas of SMT/PCB assemblies that are generally inaccessible to visual inspection, the new X-ray system will be used to inspect Ball Grid Array (BGA), leadless, and connector components to identify problems such as solder joint defects, shorts, opens, etc...
Industry News | 2013-12-03 15:52:18.0
Saline Lectronics, Inc.announces that it has purchased Cogiscan’s Track, Trace and Control (TTC) system.
Industry News | 2014-05-08 12:04:42.0
Saline Lectronics, Inc. announces that it has officially implemented Cogiscan’s Track, Trace and Control (TTC) system.
Industry News | 2017-05-15 15:57:19.0
Nikon Metrology has recently provided its high-precision, flat-panel based X-ray inspection system, XT V 160 to help Michigan company, Saline Lectronics inspect its most complex and challenging technical assemblies to the highest standard.
Automatic Pick and Place TP50V Product Description: TP series is a fully automatic vision SMT pick and place machine, it can mount a variety of components through the vacuum nozzle can be mounted .it is the most cost effective automatic placement e
Automatic Pick and Place TP50V Product Description: TP series is a fully automatic vision SMT pick and place machine, it can mount a variety of components through the vacuum nozzle can be mounted .it is the most cost effective automatic placement e
Industry News | 2015-07-10 13:55:54.0
Carlsbad, CA – July 10, 2015: Machine Vision Products today announced it would be demonstrating the diverse inspection toolbox of the MVP 850 Platform for Microelectronics and Packaging AOI platform at the Semicon West 2015 exhibition. The exhibition is at the Moscone Center in San Francisco from July 14-16 2015. Machine Vision Products are exhibiting at booth #6254 in the North Hall.
Industry News | 2019-11-05 22:08:21.0
Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.
