Full Site - : fail bga (Page 6 of 23)

BGA x-ray services 3D

Electronics Forum | Thu Jan 14 12:39:31 EST 2010 | gregcr

Hi All, We have a glenbrook x-ray in house, but I am in need of a high resolution x-ray of some failed BGA image sensors. Does anyone know of a company that does hi-res or 3D x-ray service? We are not getting enough detail to really see what may be

Bga reballing

Electronics Forum | Thu Jul 22 21:48:21 EDT 1999 | kyung sam park

Does anyone have any experiences with bga reballing. When I had reworked failed bga part with new part It was good. So I tried to reball bga detached but failed . I guess the cause of fail is thermal shock. IS IT OK TO REBALL BGA PARTS DETACHED ?

Re: Bga reballing

Electronics Forum | Thu Jul 22 22:57:14 EDT 1999 | Earl Moon

| Does anyone have any experiences with bga reballing. | When I had reworked failed bga part with new part It was good. | So I tried to reball bga detached but failed . | I guess the cause of fail is thermal shock. | IS IT OK TO REBALL BGA PARTS

Re: Bga reballing

Electronics Forum | Mon Jul 26 15:09:31 EDT 1999 | APE South

| Does anyone have any experiences with bga reballing. | When I had reworked failed bga part with new part It was good. | So I tried to reball bga detached but failed . | I guess the cause of fail is thermal shock. | IS IT OK TO REBALL BGA PARTS

BGA failure after coating

Electronics Forum | Thu Oct 01 07:03:55 EDT 2009 | davef

We doubt that Humiseal 1A33 is causing opens in your assemblies. We'd guess the opens occur earlier in the process, but are not hard failures. So, you pass your tests. When applied, the conformal coat flows into the gap in the ball crack and insulate

place BGA by FUJI IP3

Electronics Forum | Mon Apr 22 22:14:54 EDT 2002 | Gang shen

the case is that FUJI IP3 failed to place BGA ,when it is processing the BGA vision ,often occours the alert message. Our oprating system is MCS30,the software version is v1.3. anyone encounter the same problem? it is be appciatiate that feedback any

BGA placement on PGA

Electronics Forum | Thu Nov 07 14:30:38 EST 2002 | Debi Musante

We have been presented with the task of placing a BGA on top of a PGA. The previous process choice was to apply paste directly on the BGA (which failed functional testing) We are considering applying tacky flux (only) on BGA, since this is our first

BGA Reflow Issue

Electronics Forum | Wed Apr 26 10:33:57 EDT 2006 | Carol Stirling

Hi Russ, The board was ran in two orientations but with poor results. The same area of the BGA failed. I was advised today that the Process Engineer here has come to the conclusion the defect is Pick and Place machine oriented, not a process/pro

BGA failure after coating

Electronics Forum | Thu Oct 01 03:03:29 EDT 2009 | cunningham

what we are getting is open circuits not every BGA is failing we use Humiseal 1A33 and currently there is no masking instruction for around the BGA

Head in Pillow effect BGA

Electronics Forum | Fri Apr 13 09:41:41 EDT 2007 | aj

All, I have an intermittent faut with a 672 BGA where it fails in test but upon applying pressure to the BGA it works. Clearly there is an issue with the wetting of some Balls causing a poor connection. My profile looks spot on - I think I poste


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