Electronics Forum | Fri May 23 00:16:31 EDT 2014 | edriansyah
Hello all. I need you advice and opinion on my problem with BGA drop off from the boards. Initial defect was ICT fail, but due to some accident, the board fell off, and the BGA just pop out. After some search, I end up to conclude it is a black pad
Electronics Forum | Thu Nov 07 15:12:46 EST 2002 | davef
Converting BGA to PGA. Yes!!! Wouldn't want progess in packaging design to slow us down, would we? [Haaaaa. Just kidding. Probably has something to do with legacy designs; form, fit and function; and all that stuff.] Tacky flux only, like a rew
Electronics Forum | Tue Jan 30 02:38:50 EST 2001 | arul2000
This BGA could have gone through the reflow cycle two times as we understand from the BGA manufacturer, during the BGA ball attachment process. (If any ball is found missing, they replace the missed ball manually after applying flux manually and refl
Electronics Forum | Wed Mar 17 19:41:15 EST 2004 | Dreamsniper
I'm hit with the above problem and found out that the BGA's themselves have fibres on their solder balls. I have soldered some without having the knowledge of the above fibres and found that the fibres are caught between the PCB pad and the BGA solde
Electronics Forum | Wed Jan 03 09:59:52 EST 2007 | Jim
Hi, I was looking for information on failure rates for BGA components. I am analyzing our BGA rework rates and find it difficult to define a root cause when a remove and replace of the BGA component corrects the test errors. Inspection prior to re
Electronics Forum | Wed May 21 04:50:51 EDT 2008 | aj
Hi all, We had similar problems a while back. Boards would fail at test but if you applied pressure to the BGA they would pass. Turned out that during the PTH assembly process the Operators were flexing the cards during the insertion of an Oupin C
Electronics Forum | Thu Aug 13 10:58:58 EDT 2009 | davef
First piece of advice: build the board as you would any other board. Probably, you will be surprised at the holding force of the solder of the connections of the BGA, because the surface area of the solder is very large compared to the weight of the
Electronics Forum | Sat Dec 24 19:39:43 EST 2011 | dontfeedphils
I've reflowed many different size BGA's in an effort to better the connection and to help the board pass functional test. Using a middle of the road liquid flux and a convection spot rework machine and almost every time I would reflow a failed board
Electronics Forum | Tue Feb 13 14:33:16 EST 2007 | CK the Flip
So the moral of the story is..... these SAC305 BGA's were accidentally mixed in with a Leaded process, the profile couldn't get hot enough due to Tg and Td constraints on a known good QFP on the same board, and consequently, the whole assembly fail
Electronics Forum | Fri Jun 08 12:05:17 EDT 2007 | bbl
If you're not doing any fine pitch or BGA's, it's a "nice to have". With manual screen printing any paste height measurement tool you got would likely generate more fails than you could deal with unless you set the parameters so wide that almost any
