Industry Directory | Manufacturer
HILEVEL Technology, Inc. is a world leader in American made low-cost IC test systems for Production, Engineering, and Failure Analysis since 1979.
Wouldn't it be nice to see into the future? With Sherlock by DfR Solutions, you can. Sherlock is a new Automated Design Analysis Tool that allows you to predict product failure earlier in the design process, allowing you to design reliability right
New Equipment | Assembly Services
Air bearings for ultra-smooth motion All axes are fully preloaded Dual linear-motor-driven lower axis Travel to 1 m x 1 m Options include Z axis, vibration isolation, machine base and control enclosure The ABG10000 air-bearing gant
Electronics Forum | Thu Jun 16 03:23:40 EDT 2022 | leaderway0
AI/SMT spare parts and SMT equipment vendors from China-Leaderway Industrial Co., Ltd. The main distribution brands are Fuji, Samsung, Juki, Yamaha, Universal, Panasonic, Siemens, and Sony. Our websites: http://www.leadersmt.com Contact us !!! Email
Electronics Forum | Mon Dec 26 13:31:16 EST 2005 | mariss
Addendum: The boards are 2" by 2.4" (50mm by 60mm) and have 158 SMT components and 20 thru-hole parts. The nine X7R caps are distributed over the board; some are in the middle, others are near the V-grooved board edges. There is no discernable rel
Industry News | 2010-05-30 23:23:13.0
Minneapolis, MN - The Surface Mount Technology Association (SMTA) announces the Call for Papers for the 2011 Pan Pacific Microelectronics Symposium, which will be held January 18-20, 2011 on the Big Island of Hawaii. The symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems technology and assembly. The deadline for abstracts is July 16, 2010.
Industry News | 2010-08-17 13:31:00.0
The Pan Pacific Microelectronics Symposium promotes International technical interchange and provides a premier forum for extensive networking among microelectronics professionals and business leaders throughout the Pacific Basin. Participants come from Australia, China, India, Japan, Korea, North America, Southeast Asia, and Taiwan as well as Europe!
Technical Library | 2024-08-29 18:30:46.0
The mechanical experience of consumption (i.e., feel, softness, and texture) of many foods is intrinsic to their enjoyable consumption, one example being the habit of twisting a sandwich cookie to reveal the cream. Scientifically, sandwich cookies present a paradigmatic model of parallel plate rheometry in which a fluid sample, the cream, is held between two parallel plates, the wafers. When the wafers are counterrotated, the cream deforms, flows, and ultimately fractures, leading to separation of the cookie into two pieces. We introduce Oreology (/Oriːˈɒl@dʒi/), from the Nabisco Oreo for "cookie" and the Greek rheo logia for "flow study," as the study of the flow and fracture of sandwich cookies. Using a laboratory rheometer, we measure failure mechanics of the eponymous Oreo's "creme" and probe the influence of rotation rate, amount of creme, and flavor on the stress–strain curve and postmortem creme distribution. The results typically show adhesive failure, in which nearly all (95%) creme remains on one wafer after failure, and we ascribe this to the production process, as we confirm that the creme-heavy side is uniformly oriented within most of the boxes of Oreos. However, cookies in boxes stored under potentially adverse conditions (higher temperature and humidity) show cohesive failure resulting in the creme dividing between wafer halves after failure. Failure mechanics further classify the creme texture as "mushy." Finally, we introduce and validate the design of an open-source, three-dimensionally printed Oreometer powered by rubber bands and coins for encouraging higher precision home studies to contribute new discoveries to this incipient field of study
Technical Library | 2021-03-10 23:57:29.0
Latent short circuit failures have been observed during testing of Printed Circuit Boards (PCB) for power distribution of spacecraft of the European Space Agency. Root cause analysis indicates that foreign fibers may have contaminated the PCB laminate. These fibers can provide a pathway for electromigration if they bridge the clearance between nets of different potential in the presence of humidity attracted by the hygroscopic laminate resin. PCB manufacturers report poor yield caused by contamination embedded in laminate. Inspections show ...
The innovative inline soldering system for mass producers operate according to oxygen free process designed by ASSCON. Preheating and soldering is performed under oxygen free conditions. Components such as QFPs, BGAs, Flip-Chip and hybrids are proces
>>CONTACT MAC NOW Email: at@mooreplc.com Mobile: +8618020714662(WhatsApp) Skype: +8618020714662 >>>CONTACT MAC NOW ✦ Quick Details ✦ BRAND/ MANUFACTURER:SQUARE MANUFACTURER PART NUMBER:D8430 ADDITIONAL INFORMATION:Phase Failure Rela
Career Center | Houston, Texas USA | Engineering,Management,Production,Quality Control
Director of Quality - A large electro-mechanical manufacturing company in the Houston, Texas area currently has a Full-Time opening for a senior level Director of Quality. This is a direct hire position, reporting directly to the President of the c
Career Center | Appleton, Wisconsin USA | Engineering
Staff Process Engineer - Senior Job Title: Staff Process Engineer - Senior Purpose: Design, implement, and administer global manufacturing processes. Individuals may specialize in any or all of the following areas: Focus Factory Development, H
Career Center | Nariveles, Philippines | 2019-11-21 13:32:04.0
Failure Analysis Technician Quality-driven and goal-focused with strong research, planning and Problem-solving abilities. Gifted in being a technical knowledge base, Organizing workflow and improving processes.
Career Center | Mariveles, Philippines | Engineering,Production,Quality Control
Failure Analysis Technician Quality-driven and goal-focused with strong research, planning and Problem-solving abilities. Gifted in being a technical knowledge base, Organizing workflow and improving processes.
Surface Mount Technology Association (SMTA) | https://www.smta.org/iceet/workshops.cfm
. It is the role of the Failure Analysis team to establish the link between the failure mode and the failure mechanism. Once that link is understood, the path to the solution and the responsible party for it becomes clear
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
], which is the major wear-out failure mode and major source of failure for surface mount (SMT) components in electronic assemblies [8]. A specific type of voiding called planar microvoiding has been shown to lower reliability either by effectively reducing the attachment area or by weakening the solder in regions of the solder joint
