Full Site - : failure modes (Page 6 of 38)

Design for Testability and for Built-in Self Test

Training Courses | | | PCB Design Courses

The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.

EECS at University of California

Coatings and Pottings: A Critical Update

Technical Library | 2021-08-11 01:00:37.0

Conformal coatings and potting materials continue to create issues for the electronics industry. This webinar will dig deeper into the failure modes of these materials, specifically issues with Coefficient of Thermal Expansion (CTE), delamination, cracking, de-wetting, pinholes/bubbles and orange peel issues with conformal coatings and what mitigation techniques are available. Similarly, this webinar will look at the failure modes of potting materials, (e.g Glass Transition Temperature (Tg), PCB warpage, the effects of improper curing and potential methods for correcting these situations.

DfR Solutions

SMT Technician

Career Center | Delavan, Wisconsin USA | Production

*Set up printers, placement machines and reflow ovens for production. *Adjust machine parameters and CAM programs *Optimize part placement and feeder applications through CAM programs *Manipulate SPC data for solder paste height measrurements and int

Borg Indak, Inc.

Technology Seminars, Inc.

Industry Directory | Consultant / Service Provider

Serving the Educational Needs of Modern Technologies

Strategies To Mitigate The Tin Whisker Phenomenon

Technical Library | 2023-02-13 19:04:25.0

The tin whisker phenomenon is a failure mode associated with all electronic devices that use a number of low melting point elements (e.g., Sn, Cd, In) in operations such as soldering. Recognized many years ago, the problem was minimized by adding lead, now identified as a hazardous substance and banned

Vicor Corporation

Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World

Technical Library | 2009-04-30 18:06:24.0

This presentation surveys the most significant via and via-related laminate failure mechanisms from past to present using data from current induced thermal cycling (CITC) testing, failure analysis, and other sources. The relative life and failure modes of thru vias, buried vias, and microvias (stacked vs. non-stacked) are compared, along with the affect of structure, materials, and peak temperatures on the above. The origin of via-induced laminate failures such as "eyebrow cracks" and Pb free related internal delamination is also explored.

i3 Electronics

FMEA/FMECA Software

FMEA/FMECA Software

New Equipment |  

FMEA-Pro� 5 is a revolutionary software tool that enables you to perform a Failure Modes and Effects Analysis of manufactured products from the automotive, aerospace, defense and consumer electronics industries, to name just a few. This program is fu

Dyadem International Ltd.

FMEA/FMECA Software

New Equipment |  

FMEA-Pro� 5 is a revolutionary software tool that enables you to perform a Failure Modes and Effects Analysis of manufactured products from the automotive, aerospace, defense and consumer electronics industries, to name just a few. This program is fu

Dyadem International Ltd.

Bob Willis Online Training

Bob Willis Online Training

New Equipment | Education/Training

Our web based seminars represent an efficient way for you and your team to develop practical knowledge, delivering expert advice and guidance to you where, when and how you choose. Simple webinars offer a low cost and time efficient training option.

ASKbobwillis.com

Quality Engineer

Career Center | Tulsa, Oklahoma USA | Engineering

High tech Electronics manufacturing service EMS provider is looking for a Quality Engineer. Ideal candidate should have: Good background in EMS or contract electronics manufacturing (CEM) Desired experience in any of following - aerospace, defense

Brennan and Brennan utive Search


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High Throughput Reflow Oven

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Pillarhouse USA for Selective Soldering Needs

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