Technical Library | 2015-02-19 16:54:34.0
Pad cratering is an important failure mode besides crack of solder joint as it’ll pass the regular test but have impact on the long term reliability of the product. A new pin pull test method with solder ball attached and positioning the test board at an angle of 30º is employed to study the strength of pad cratering. This new method clearly reveals the failure mechanism. And a proper way to interpret the finite element analysis (FEA) result is discussed. Impact of pad dimension, width and angle of copper trace on the strength is included. Some findings not included in previous research could help to guide the design for better performance
Career Center | San Diego, California USA | Engineering
Provide process design support to one or more product lines. Develop, optimize, and implement manufacturing processes. Individual will develop processes for a number of programs simultaneously. Will also be responsible for sustaining existing proc
Career Center | St. Louis, Missouri USA | Production
A growing Tier 1 Automotive Supplier is seeking an SMT Process Engineer to join thier team! Primarily responsible for program and process development, analysis and troubleshooting of all Surface Mount Technology (SMT) processes and equipment. Must
Career Center | St. Louis, Missouri USA | Production
A growing Tier 1 Automotive Supplier is seeking a Sr. Quality Engineer to join thier team! The Sr. Quality Engineer will act as the right hand man to the Quality Manager. Provides work direction for Quality Technician and Product/Process Auditors po
Career Center | Indianapolis, Indiana USA | Production
A growing Tier 1 Automotive Supplier is seeking a Quality Engineer to join their team! Insures a quality system is in place that prevents defects and provides factual information for continuous improvement. 1.Designs systems for recording and analy
Career Center | , | Engineering
The New Product Introduction Engineer coordinates manufacturing costs for quote, design for manufacturing, pre-production builds and production launch through the involvement of cross-functional teams. Manages project budget Responsibilities � Inp
Career Center | County Durham, United Kingdom | Engineering
I am currently working on behalf of a Global Leader in Automotive Safety Systems based in the County Durham area of the UK. They are currently seeking to recruit an SMT Engineer whose main duties and responsibilities will compromise of the following
Industry News | 2018-01-16 11:59:10.0
Vision Engineering has teamed up with industry-expert Bob Willis to broadcast a free Electronics Academy Webinar aimed at identifying the issues affecting PCB/SMT assembly and the challenges of achieving Zero Defect Manufacture. The next webinar, Eliminate Printed Circuit Board Problems & Failure Modes will take place on January 23rd at 2:30 EST.
Technical Library | 2023-03-16 18:51:43.0
Conductive anodic filament (CAF) formation was first reported in 1976.1 This electrochemical failure mode of electronic substrates involves the growth of a copper containing filament subsurface along the epoxy-glass interface, from anode to cathode. Despite the projected lifetime reduction due to CAF, field failures were not identified in the 1980s. Recently, however, field failures of critical equipment have been reported.2 A thorough understanding of the nature of CAF is needed in order to prevent this catastrophic failure from affecting electronic assemblies in the future. Such an understanding requires a comprehensive evaluation of the factors that enhance CAF formation. These factors can be grouped into two types: (1) internal variables and (2) external influences. Internal variables include the composition of the circuit board material, and the conductor metallization and configuration (i.e. via to via, via to surface conductor or surface conductors to surface conductors). External influences can be due to (1) production and (2) storage and use. During production, the flux or hot air solder leveling (HASL) fluid choice, number and severity of temperature cycles, and the method of cleaning may influence CAF resistance. During storage and use, the principal concern is moisture uptake resulting from the ambient humidity. This paper will report on the relationship between these various factors and the formation of CAF. Specifically, we will explore the influences of printed wiring board (PWB) substrate choice as well as the influence of the soldering flux and HASL fluid choices. Due to the ever-increasing circuit density of electronic assemblies, CAF field failures are expected to increase unless careful attention is focused on material and processing choices.
Technical Library | 2020-07-22 19:39:05.0
The PWB industry needs to complete reliability testing in order to define the minimum copper wrap plating thickness requirement for confirming the reliability of PTH structures. Predicting reliability must ensure that the failure mechanism is demonstrated as a wear-out failure mode because a plating wrap failure is unpredictable. The purpose of this study was to quantify the effects of various copper wrap plating thicknesses through IST testing followed by micro sectioning to determine the failure mechanism and identify the minimum copper wrap thickness required for a reliable PWB. Minimum copper wrap plating thickness has become an even a bigger concern since designers started designing HDI products with buried vias, microvias and through filled vias all in one design. PWBs go through multiple plating cycles requiring planarization after each plating cycle to keep the surface copper to a manageable thickness for etching. The companies started a project to study the relationship between Copper wrap plating thickness and via reliability. The project had two phases. This paper will present findings from both Phase 1 and Phase 2.
