Electronics Forum | Fri Sep 18 04:19:33 EDT 2009 | gregoryyork
Glycerine on a PCB is very bad news as it is Hygroscopic and can attract moisture to the Circuit. Alot of this used to be used in HASL Fluxes and is a no go for Circuits that are not going to be washed. They too could dissolve the natural Halides fro
Electronics Forum | Wed Jul 20 15:18:35 EDT 2005 | FW
Hi! We have both Dip & Spray conformal coating processes & have never done any kind of baking before the process! I am assuming the reason for baking would be the same - ie, remove any moisture on the brds since moisture will create failure of the co
Electronics Forum | Wed Dec 24 11:23:22 EST 2008 | childs
I can't seem to locate any information/concerns about moisture entrapment in IC packages on the promary side in a double sided SMT assembly using water soluable solder paste when soldering the second side. A typical process would assemble/reflow/cle
Electronics Forum | Fri May 15 10:27:16 EDT 1998 | Justin Medernach
| | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin package
Electronics Forum | Tue May 23 15:37:30 EDT 2006 | bman
I was trying to hide my shame on that one, but we have seen failures that we attributed to moisture issues as well. There was nothing to see with the x-ray, but the BGAs didn't work. Replaced the parts with some that had been properly stored/baked
Electronics Forum | Fri May 15 10:06:28 EDT 1998 | Mike
| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |
Electronics Forum | Fri Mar 08 04:27:03 EST 2013 | grahamcooper22
Homemade cabinet may sound like a simple solution but you need to think about making sure the RH is always less then 5% and everything must be ESD safe....ESD is more of an issue at LOW RH levels...so the glass / plastic in any door needs ESD coating
Electronics Forum | Mon May 18 11:39:30 EDT 1998 | Earl Moon
| | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin package
Electronics Forum | Fri May 15 10:41:12 EDT 1998 | Dave F
| | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin pac
Electronics Forum | Mon Feb 19 13:04:17 EST 2001 | billschreiber
The ultrasonic frequency used in today�s stencil cleaners is usually a 40 kHz �sweep� frequency (also used on semiconductors and other sensitive cleaning applications). This frequency is not low enough to cause stencil damage (the lower the frequen
