Electronics Forum | Wed Oct 17 09:38:55 EDT 2001 | fmonette
Dear Daniel, I assume that these components are moisture-sensitive. If they have absorbed too much moisture prior to reflow you might be experiencing popcorning. This typically shows up as a bulge over the surface of the die, in the center of the p
Electronics Forum | Tue May 02 14:19:26 EDT 2000 | Bill Schreiber
There are two primary causes of epoxy adhesive bond failure, heat and over exposure to moisture. Ultrasonic cavitation is a only a mechanical "scrubbing" action on a microscopic level. However, if the adhesive bond is week or has small areas of det
Electronics Forum | Thu Oct 02 17:55:16 EDT 2008 | davef
~le sigh~ makes a good point about forcing bent leads into the solder, letting the solder cool, and releasing the force on the lead. On the other hand, reforming leads of components prior to assembly is dangerous, also, because the "bending of a lead
Electronics Forum | Mon Apr 01 20:10:24 EST 2002 | davef
Oh. [Howabout if I smack you?] If ahma connectin� wif whut yer sayin�, you: * Don�t like the appearance of the glue slobberin� out from under the component even though there is no apparent glue on solderable surfaces. * Concerned about the hydrosco
Electronics Forum | Thu Jan 16 16:15:27 EST 2003 | billg2753
I have received a few boxes of fully assembled boards that have damaged packaging boxes due to rain water. There is visible moisture inside the ESD bag. I have no idea how long these boards have been exposed to moisture. Does anyone have a procedure
Electronics Forum | Tue Feb 19 08:46:06 EST 2008 | rgduval
The last time I encountered dendrite growth, it was within a component package. I believe we were experiencing it within a crystal. The root cause was water intrusion during in line wash. The component was supposed to have been sealed and safe for
Electronics Forum | Fri Jan 30 10:29:48 EST 2009 | petep
We have a potential new customer who has special PCB requirements. I do not know a lot of details at this point, but have several questions. One of their assemblies has within it , a MID, Solid foil layer, completely isolating one side of the PCB f
Electronics Forum | Mon Jan 06 17:37:54 EST 2014 | hegemon
Make sure you are providing an adequate moisture bake out prior to wave soldering. It sounds moisture related since is so random. I would suggest perhaps 120C for a minimum of 8 hours to drive the moisture out, and then complete your wave soldering
Electronics Forum | Tue Dec 14 02:19:03 EST 2010 | sachu_70
With lower Humidity levels, we expose to greater risk towards ESD related failures seen on components. Pl. ensure to have your entire work area fully guarded against ESD and maintain proper material handling instructions across the entire flowline un
Electronics Forum | Thu Jul 31 15:14:59 EDT 2014 | kenkay
Turns out the seal was being broken from poor handling allowing moisture in. Thanks for all the info pointing me in the right direction!!
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