Electronics Forum | Mon Aug 13 18:16:31 EDT 2001 | fmonette
Be very careful how you perform the removal process if you want to re-use BGA/CSP devices. As you are aware, the majority of these components are classified as moisture-sensitive by the manufacturer. This means that if they absorb too much moisture
Electronics Forum | Wed Apr 24 21:35:34 EDT 2002 | davef
Ooooo, much better. Tough to say, because of all the variables [ie, different materials, moisture level, temperature, etc]. Plastic encapsulated devices, especially IC, absorb water from the air, which is violently released during soldering. Typica
Electronics Forum | Thu Jul 31 14:58:06 EDT 2014 | rgduval
If it has been determined that it is definitely the relays (and not some other circuit device), you'll want to get the vendor/manufacturer involved for some failure analysis. They'll cut open the components, and try to figure out what's going on in
Electronics Forum | Tue May 19 02:59:46 EDT 1998 | P.L. Sorenson - Technical Consultant
| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |
Electronics Forum | Fri Nov 02 19:34:19 EDT 2018 | sarason
I am assuming that your application is Automotive. The logic here is that the product has got to at least run for 8 years or more. The prebake removes any moisture that may creep into the product during the wait time. A little moisture combined with
Electronics Forum | Fri May 15 04:06:33 EDT 1998 | Alan Pestell
We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. How d
Electronics Forum | Tue Nov 14 08:17:09 EST 2006 | Rob
Degassing - the air in the void above the electrolyte expands, or in some cases the electrolyte vapourises, blowing the top of the cap from the base. Sometimes electrolyte can also leak out around the base seal. This is also a failure as the cap wo
Electronics Forum | Mon Sep 09 17:01:21 EDT 2013 | proteus
I wish I knew the MSL. The factory data sheet from 1995 does not list the specification. The moisture problem makes perfect sense for what I'm seeing. When we replace these parts by hand (no reflow) the failure rate goes down to almost non-exist
Electronics Forum | Fri May 13 17:28:43 EDT 2016 | dyoungquist
Depends a little on how long it was exposed to the wet environment as moisture absorption by electrical components is a very slow process. That said, MSL 1 rated components can be exposed to high humidity indefinitely and still not need to be baked.
Electronics Forum | Mon Mar 19 08:56:17 EST 2001 | fmonette
One very important consideration in your situation is to determine if you have moisture sensitive components on these boards. If you have any device classified level 3 or higher then you have a very high level of risk associated with moisture sensit
