Electronics Forum | Tue May 19 02:59:46 EDT 1998 | P.L. Sorenson - Technical Consultant
| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |
Electronics Forum | Fri Nov 02 19:34:19 EDT 2018 | sarason
I am assuming that your application is Automotive. The logic here is that the product has got to at least run for 8 years or more. The prebake removes any moisture that may creep into the product during the wait time. A little moisture combined with
Electronics Forum | Fri May 15 04:06:33 EDT 1998 | Alan Pestell
We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. How d
Electronics Forum | Tue Nov 14 08:17:09 EST 2006 | Rob
Degassing - the air in the void above the electrolyte expands, or in some cases the electrolyte vapourises, blowing the top of the cap from the base. Sometimes electrolyte can also leak out around the base seal. This is also a failure as the cap wo
Electronics Forum | Mon Sep 09 17:01:21 EDT 2013 | proteus
I wish I knew the MSL. The factory data sheet from 1995 does not list the specification. The moisture problem makes perfect sense for what I'm seeing. When we replace these parts by hand (no reflow) the failure rate goes down to almost non-exist
Electronics Forum | Fri May 13 17:28:43 EDT 2016 | dyoungquist
Depends a little on how long it was exposed to the wet environment as moisture absorption by electrical components is a very slow process. That said, MSL 1 rated components can be exposed to high humidity indefinitely and still not need to be baked.
Electronics Forum | Mon Mar 19 08:56:17 EST 2001 | fmonette
One very important consideration in your situation is to determine if you have moisture sensitive components on these boards. If you have any device classified level 3 or higher then you have a very high level of risk associated with moisture sensit
Electronics Forum | Sun Aug 17 19:06:42 EDT 2014 | natashakt
Hi All, I have been looking in to some failures of PCB's in Assembly. After SMT the boards are stored for different periods of time in high humity environment (72% RH and 21.4 degrees Celsius) before being sent to Assembly to be handsoldered/put thr
Electronics Forum | Mon Dec 22 16:02:22 EST 1997 | Justin Medernach
| what is your experience about the presence of the voids in the joints ? | Are they dangerous and when ? Vincenzo, Voids in solder joints can be caused by a number of factors. Let's begin with the flux vehicle in your soldering media. If the prope
Electronics Forum | Fri Feb 01 10:19:22 EST 2002 | cyber_wolf
Whoa! I beg to differ my friend. The cure profile is VERY critical in Adhesive curing, especially if your are screen printing. When you screen print adhesive you are leaving it exposed to the atmosphere for a period of time. SMT adhesive by nature i
