Electronics Forum | Fri May 15 14:41:25 EDT 1998 | Terry Burnette 512-933-5783
| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |
Electronics Forum | Tue Jul 07 07:44:23 EDT 1998 | Wayne
| Hey Dave... I agree with Steve, get them dry. Even though you are using DI water, once exposed to normal atmoshere the DI residue water will become contaminated. Fungus and board failure down the road. Not to mention if you plug it into test an
Electronics Forum | Wed Feb 01 11:47:07 EST 2006 | Mike
James, If you have a true MSD issue, then baking them AFTER your reflow is not going to fix the issue. I would have to agree with GS and look at trapped cleaner media (if your not No-clean) under the components, or inside connectors. If your runnin
Electronics Forum | Wed Jan 09 09:31:53 EST 2008 | flipit
I solder LEDs everyday from 0402 sizes on up. I work for an optical company so every product I make has LEDs. Some products have hundreds of LEDs per circuit. The problem is that clear materials are not filled materials and thus don't have the adv
Electronics Forum | Fri Sep 05 13:33:28 EDT 2008 | jmiller
We are having problems with relay package seals cracking and moisture intrusion in power relays on thru-hole assemblies. we use a few different brands of thru-hole relays, we are using a sn-pb process right now and just going to lead-free. the contra
Electronics Forum | Thu Feb 05 02:52:37 EST 2009 | sachu_70
The problem expressed by you need not necessarily be caused by the Reflow process even though it's effect cannot be ruled out. I suggest to validate periodically the Reflow Oven performance as also optimise Reflow parameters through a documented vali
Electronics Forum | Wed Aug 26 03:21:00 EDT 2009 | sergey2007
Hi Graham, the MSD level of the component is 3. I am not sure that my customer properly stored the component before the soldering process. And I am not sure that it was dried at all. The customer says they did everything that they had to, but I just
Electronics Forum | Wed Jul 17 11:45:48 EDT 2002 | fmonette
The current IPC/JEDEC standard J-STD-033 for moisture-sensitive devices does not include a bake cycle at 90C (it includes cycles at 40C and 125C for non-assembled components in reels or trays). However, the upcoming revision, which should be release
Electronics Forum | Wed Aug 30 00:16:15 EDT 2000 | Craig
We are reflowing ceramic resonators and are finding their tops falling/popping off when handling the pcbs during final assy. The epoxy seems to be coming off the components base and adherring to the lid. The components are "RFM resonators", case type
Electronics Forum | Thu Sep 03 18:48:52 EDT 1998 | Pete Sorenson
| I am in need of possible causes and solutions to capacitors that are failing in the field. | Are there issues in our process that need to be | checked? | Some people said the problems are due to improper | storage. Others say it is thermal stre
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