Electronics Forum | Wed Sep 02 08:44:50 EDT 1998 | Kelly Morris
| Hi, | We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent it.
Electronics Forum | Mon Jul 06 19:35:08 EDT 1998 | Steve Gregory
Hey Dave... The only reason I can think of wanting the boards good and dry after the wash is just what you've listed...power-up. I had some boards that went right into ICT right after the cleaner but still had a little water in the right angle c
Electronics Forum | Wed Sep 11 23:20:44 EDT 2002 | scottefiske
Profiles are absolutely the first course of action to validate. A few additional questions would be: * Moisture can cause warping as well, verify the manufacturers recommended handling procedures were followed. * Where is the suspect BGA located
Electronics Forum | Tue Jul 31 15:33:30 EDT 2007 | gregs110
I have seen a few threads about delamination issues on IS410 laminate in RoHS applications. I have recently been running into a rash of issues on 4 different part numbers with a single PWB source. All the parts have been built fine in the past with
Electronics Forum | Mon Apr 26 12:51:45 EDT 1999 | Bob
Steve, Moisture sensitivity needs to be taken seriously. Being in the commercial end of electronics now, I am using many plastic packages. Unfortunately, moisture sensitivity processing is not black and white and it does require procedures and dis
Electronics Forum | Wed Nov 11 10:08:38 EST 1998 | Magnus
| | Hi, | | We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent
Electronics Forum | Thu May 08 11:58:12 EDT 2003 | fmonette
Hi Chrissie, This might be old news to you but I just wanted to make sure that you are aware of all the implications of BGA rework relative to the control of moisture-sensitive components. For example, you need to keep track of the total exposure t
Electronics Forum | Sat Jan 20 20:54:03 EST 2001 | fmonette
Dear Mike, As you might have noticed from the labels on the dry bags, the maximum floor life is specified by the component manufacturer and it can range from 1 year (level 2) down to a few hours after mandatory bake (level 6). This limit is based o
Electronics Forum | Tue Mar 09 12:13:27 EST 2004 | Gabriele
I want just to confirm what Dave suggested you. J-STD-033a, par 6. Boards Rework tells you plenty of useful informations. 6.1 Component removal, RWK and remount 6.1.1 Removal for Failure Analysi 6.1.2 Removal & Remount 6.2 Baking of Populated Boar
Electronics Forum | Fri May 15 10:11:19 EDT 1998 | Justin Medernach
| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |
