Industry News | 2017-10-23 05:53:04.0
Selected Bob Willis webinars are released for the end of 2017 and the beginning of 2018. Book online to secure your place or for your team training. If the date or time does not suit your schedule its also possible to arrange online training at a time and date that is better for you http://www.bobwillis.co.uk
Technical Library | 2017-07-20 15:18:15.0
As electronic devices increase functionality in smaller form factors, there will be limitations, obstacles and challenges to overcome. Advances in component technology can create issues that may have time delayed effects. One such effect is device failure due to soldering residues trapped under bottom terminated components. If the residues trapped under the component termination are active and can be mobilized with moisture, there is the potential for ion mobilization causing current leakage.
Industry News | 2015-11-12 21:24:58.0
KYZEN is pleased to announce that it will present at the LED A.R.T. Symposium, scheduled to take place Nov. 17-19, 2015 at the Crowne Plaza Midtown in Atlanta, GA. Dr. Mike Bixenman will present the paper titled “LED Failure Mechanisms That Can be Linked to Post Assembly Cleaning.”
Industry News | 2003-01-20 18:00:18.0
February 24-26, 2003
Industry News | 2020-11-14 08:21:00.0
Our webinars for 2021 have now been launched with the first three dates for January, February and March available to book online. In addition our growing library of online archive video recordings are ready to provide support and education world wide from our website bobwillis.co.uk Solder Wicking Defects - Benefits, Causes & Cures 11th Jan at 2.30pm UK Time Solder Ball Elimination – In Wave, Selective & Reflow - Webinar 8th Feb at 2.30pm UK Time Dendrite & Corrosion Failure on PCBs – Causes & Cures - Webinar 8th March at 2.30pm UK Time
Industry News | 2024-03-26 13:28:39.0
ZESTRON will be presenting at the upcoming IPC APEX Expo on the critical challenges and innovations in high-voltage (HV) electronic assemblies within the realm of E-Mobility. The presentation, titled "EV Electronics: Design, Manufacturing, and Reliability Challenges," will feature industry expert Olaf Schoenfeld, Ph.D., and will take place from 11:30 AM to 2:00 PM on Thursday, April 11.
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
Industry News | 2017-09-25 15:10:07.0
SMART Group, Europe’s largest technical trade association focusing on Surface Mount And Related Technologies, announces that it is co-sponsoring the Process, Design & Reliability Seminar on 9 November with the NPL.
Industry News | 2010-10-27 18:18:54.0
STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that it has been awarded a Global Technology Award in the category of Contract Services
Includes: 100mm Chuck, Signatone XXC5S/LDC1 Probe Station #XXC5S-NOV, Signatone S-400 Controller, Signatone SA-Zoom, Signatone X/Y Axis Controller XXC5T-NOV, Signatone S-96MW Micropositioner, Kinetic System Vibraplane Table, Ready Lamp ELC-15 Light S
