Electronics Forum | Wed Mar 08 19:29:55 EST 2000 | Charles Leech
This is just an Alert: We had a lesson on the effect of air shipments of devices which have been fully saturated with moisture. After being in a pressure cooker for two hours in Singapore, devices were sealed in metalized vapor barrier bags. They we
Electronics Forum | Wed Mar 08 19:29:55 EST 2000 | Charles Leech
This is just an Alert: We had a lesson on the effect of air shipments of devices which have been fully saturated with moisture. After being in a pressure cooker for two hours in Singapore, devices were sealed in metalized vapor barrier bags. They we
Electronics Forum | Mon Sep 11 14:15:28 EDT 2000 | Gary
I am looking for some details about the failure modes in popcorned components. Does the component usually fail to operate. Is the damage likely to extend to the gold bond, wires, or substrate. We have experienced a high failure rate on a subset of
Electronics Forum | Fri Sep 18 04:19:33 EDT 2009 | gregoryyork
Glycerine on a PCB is very bad news as it is Hygroscopic and can attract moisture to the Circuit. Alot of this used to be used in HASL Fluxes and is a no go for Circuits that are not going to be washed. They too could dissolve the natural Halides fro
Electronics Forum | Wed Jul 20 15:18:35 EDT 2005 | FW
Hi! We have both Dip & Spray conformal coating processes & have never done any kind of baking before the process! I am assuming the reason for baking would be the same - ie, remove any moisture on the brds since moisture will create failure of the co
Electronics Forum | Wed Dec 24 11:23:22 EST 2008 | childs
I can't seem to locate any information/concerns about moisture entrapment in IC packages on the promary side in a double sided SMT assembly using water soluable solder paste when soldering the second side. A typical process would assemble/reflow/cle
Electronics Forum | Fri May 15 10:27:16 EDT 1998 | Justin Medernach
| | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin package
Electronics Forum | Tue May 23 15:37:30 EDT 2006 | bman
I was trying to hide my shame on that one, but we have seen failures that we attributed to moisture issues as well. There was nothing to see with the x-ray, but the BGAs didn't work. Replaced the parts with some that had been properly stored/baked
Electronics Forum | Fri May 15 10:06:28 EDT 1998 | Mike
| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |
Electronics Forum | Fri Mar 08 04:27:03 EST 2013 | grahamcooper22
Homemade cabinet may sound like a simple solution but you need to think about making sure the RH is always less then 5% and everything must be ESD safe....ESD is more of an issue at LOW RH levels...so the glass / plastic in any door needs ESD coating
