Parts & Supplies | Pick and Place/Feeders
40068459 FX-1 T AXIS MOTOR ASM 40065066 FX-1R T AXIS SERVO MOTOR HC-BH0136L-S14 40068459=40065066 40068459 FX-1 T AXIS MOTOR ASM 40065066 FX-1R T AXIS SERVO MOTOR HC-BH0136L-S14 40068459=40065066 5 pieces 40068459 FX-1 T AXIS MOTOR ASM 40065066 FX
Used SMT Equipment | X-Ray Inspection
This is a used NXR-1525 Xray System can be used to for PCB X-ray inspection of BGA and other SMD Devices. It is a high resolution X-ray system that can show inner layer traces of the Circuit Board. The date of manufacture is September 1999. It
Used SMT Equipment | Soldering - Reflow
BTU Pyramax 100A Reflow Oven Vintage: 2012 LOW HOURS Edge Rail Mesh Belt L to R Flow Programmable Width Adjust Smart Tracker SMEMA Bottom Cooling Fans 480V 3-Phase UPGRADE Kit Recently Added ($13k Value) - Intellimax 2 Module Assembly - Wincon 7.2 So
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Wed Feb 14 00:00:00 EST 2024 - Fri Feb 16 00:00:00 EST 2024 | San Francisco, California USA
Wafer-Level Packaging Symposium
Parts & Supplies | Pick and Place/Feeders
Juki Screw 113X0.5 L8 SM-1030801-SN Juki smt spare parts smt machine 40050244 JUKI 2070/2080 X MOTOR 40053295 JUKI 2070/2080 Y MOTOR 40044534 JUKI 2070/2080 Z MOTOR 40044533 JUKI 2070/2080 T MOTOR 40065497 X_FAN_CON_BRACKET 40065496 X_FAN40_
Parts & Supplies | Pick and Place/Feeders
XH01431 Fuji NXT Mounter Accessories Y-axis Motor Fan Model: Fuji FUJI NXT placement machine Specification: Y-axis motor fan Material number: XH01431 Name: Y-axis motor fan RH02471 FUJI NXT motherboard power cord W1022A FUJI NXT M4 Nut Spri
Parts & Supplies | Assembly Accessories
Supply Orginal HELLER CARRY MOTOR S9D100-90CH ( OC83 ) FOR HELLER MACHINE Specifications: Brand Name FAN SPEED CONTROLLER Part number Model Ensure Test in machine before shipping Guarantee Original 100% and working We also Supply
Industry News | 2016-06-19 19:44:55.0
The SMTA and Chip Scale Review magazine are pleased to announce the Keynote Presenters for the 13th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.
Technical Library | 2024-08-29 18:30:46.0
The mechanical experience of consumption (i.e., feel, softness, and texture) of many foods is intrinsic to their enjoyable consumption, one example being the habit of twisting a sandwich cookie to reveal the cream. Scientifically, sandwich cookies present a paradigmatic model of parallel plate rheometry in which a fluid sample, the cream, is held between two parallel plates, the wafers. When the wafers are counterrotated, the cream deforms, flows, and ultimately fractures, leading to separation of the cookie into two pieces. We introduce Oreology (/Oriːˈɒl@dʒi/), from the Nabisco Oreo for "cookie" and the Greek rheo logia for "flow study," as the study of the flow and fracture of sandwich cookies. Using a laboratory rheometer, we measure failure mechanics of the eponymous Oreo's "creme" and probe the influence of rotation rate, amount of creme, and flavor on the stress–strain curve and postmortem creme distribution. The results typically show adhesive failure, in which nearly all (95%) creme remains on one wafer after failure, and we ascribe this to the production process, as we confirm that the creme-heavy side is uniformly oriented within most of the boxes of Oreos. However, cookies in boxes stored under potentially adverse conditions (higher temperature and humidity) show cohesive failure resulting in the creme dividing between wafer halves after failure. Failure mechanics further classify the creme texture as "mushy." Finally, we introduce and validate the design of an open-source, three-dimensionally printed Oreometer powered by rubber bands and coins for encouraging higher precision home studies to contribute new discoveries to this incipient field of study