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2009 International Wafer-Level Packaging Conference Dates and Location Announced

Industry News | 2008-12-06 02:26:28.0

Minneapolis, MN � The SMTA and Chip Scale Review Magazine are pleased to announce the dates for the 2009 International Wafer-Level Packaging Conference. The 6th annual offering of the IWLPC will be held on October 27-30, 2009 at the Santa Clara Marriott in Santa Clara, California.

Surface Mount Technology Association (SMTA)

Innovative Technology Center at IPC APEX EXPO Highlights Leading Edge Technologies.

Industry News | 2010-03-27 19:26:29.0

BANNOCKBURN, Ill., USA, - IPC - Association Connecting Electronics Industries® announces the products that will be featured in the Innovative Technology Center (ITC) at IPC APEX EXPO™, April 6–8, 2010, in Las Vegas. Assessed by an IPC Review Board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.

Association Connecting Electronics Industries (IPC)

IPC PCB Executive Agent Task Force Optimistic About Efforts: Two Government Reports Recognize Vital Role of U.S. PCB Industry.

Industry News | 2010-03-27 19:03:08.0

BANNOCKBURN, Ill., USA, - Following a year of active engagement with Congress and Department of Defense (DoD) policy makers, IPC and the IPC PCB Executive Agent Task Force members' are pleased to see their efforts are having a noticeable effect. Two recently released reports from the DoD and the U.S. Commerce Department emphasize the government’s growing awareness of the importance of the U.S. printed circuit board industry in protecting national security.

Association Connecting Electronics Industries (IPC)

IPC Volunteers Honored for Contributions to Electronics Industry at IPC APEX EXPO

Industry News | 2015-03-02 21:09:35.0

IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.

Association Connecting Electronics Industries (IPC)

Green Circuits Inc. Earns IPC J-STD-001/IPC-A-610 and IPC J-STD-001 Space/Military Addendum Qualified Manufacturers Listings

Industry News | 2023-08-29 07:15:13.0

IPC's Validation Services Program has awarded an IPC J-STD-001/IPC-A-610 Qualified Manufacturers Listing (QML) and IPC J-STD-001 Space/Military Addendum Qualified Manufacturing Listing (QML) to Green Circuits Inc., San Jose, Calif. Green Circuits Inc. is a full-service electronics manufacturing services (EMS) partner to leading original equipment manufacturers (OEMs), providing high-quality design, prototyping and full-scale production services for all types of printed circuit boards and complex systems.

Association Connecting Electronics Industries (IPC)

SMTA Announces 2017 Educational Programming

Industry News | 2017-02-05 10:18:08.0

The SMTA is pleased to announce its 2017 Educational Programming that includes conferences, webtorials and webinars, certification program and online training courses.

Surface Mount Technology Association (SMTA)

SMTA Organizes Two Technical Conferences

Industry News |

Surface Mount Technology Association (SMTA)

2002-02-20 09:09:07.0

New IPC Solder Manufacturing Council Formed

Industry News |

Association Connecting Electronics Industries (IPC)

2002-03-04 07:32:43.0

TOM SANDMAN JOINS IPC AS CHIEF FINANCIAL OFFICER

Industry News | 2014-03-21 16:23:52.0

IPC – Association Connecting Electronics Industries® announces that Tom Sandman has joined the IPC staff as chief financial officer (CFO). As CFO, Sandman is responsible for leading IPC’s global financial operations and staff.

Association Connecting Electronics Industries (IPC)

International Wafer-Level Packaging Conference (IWLPC) Call for Papers

Industry News | 2015-04-07 15:57:40.0

SMTA and Chip Scale Review magazine are pleased to announce plans for the 12th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. This premier industry event explores leading-edge design, material, and process technologies being applied to Wafer-Level Packaging applications. There will be special emphasis on the numerous device and end product applications (RF/wireless, sensors, mixed technology, optoelectronics) that demand wafer level packaging solutions for integration, cost, and performance requirements.

Surface Mount Technology Association (SMTA)


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