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TI New and Original TMS320F28335PGFA  in Stock  IC  LQFP176  , 21+     package

TI New and Original TMS320F28335PGFA in Stock IC LQFP176 , 21+ package

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TI New and Original TMS320F28335PGFA  in Stock  IC  LQFP176  , 21+     package TMS320F28335PGFA C2000™ 32-bit MCU with 150MIPS, FPU, 512KB Flash, EMIF, 12-bit ADC Today's Hot Deals: ADS1256IDBR SSOP28 TI 21+ PIC12F675-I/P DIP8 MICROCHIP 21+ W971

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NXP New and Original MK60DN512VLQ10  in Stock  IC  LQFP144  , 22+     package MK60DN512VLQ10 Kinetis® K60-100 MHz, mixed-signal integrated microcontroller (MCU) based on ARM® Cortex®-M4 core Today's Hot Deals: ADS1256IDBR SSOP28 TI 21+ PIC12F675-

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BGA rework

Electronics Forum | Tue Feb 20 16:56:36 EST 2001 | davef

There has been substantial amount of FEA done on predicting BGA ball reliability, but this has most often been applied to assessing the reliability of the design of products, rather than the effects of rework. This sounds like an interesting proje

BGA Placement on Flex

Electronics Forum | Tue Jan 21 10:55:26 EST 2003 | MA/NY DDave

Hi From what you write no one here should have an answer since too little data is supplied. You might need to go to an FEA modelling shop to model the stresses and observe fatique life, or find a group to discuss your process and your application p

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