New Equipment | Test Equipment - Bond Testers
feature www.shuttlestar-global.com • 90~110kV 5µm closed X-ray tube, 4/2”image intensifier with 200M mega pixels CCD camera • Multi-function workstation with&plus
New Equipment | Test Equipment - Bond Testers
feature • 100~130kV 5µm closed X-ray tube, high sensitive image intensifier with 200M mega pixels CCD camera • Multi-function intensifier with±60° tilt imitat
New Equipment | Test Equipment - Bond Testers
• 100~130kV 5µm closed X-ray tube, high sensitive image intensifier with 200M mega pixels CCD camera • Multi-function workstation with±70° tilt and X-Y-Z-Q-M multi-axis movement and CNC auto-detect &bu
FACTS²™ DF2400™ C‑SAM® Automated In-line Inspection Tool for Defect-Free Production Without Sacrificing Throughput The FACTS²™ delivers state-of-the-art, automated in-line inspection for quality and process control. Delivering high throughput wit
Industry News | 2011-03-10 21:20:06.0
Juki Corporation will showcase its latest assembly systems in Booth #1559 at the upcoming IPC APEX EXPO.
Industry News | 2004-11-19 16:01:40.0
Perllo Technologies LLC and ECM Electronics Ltd. are pleased to announce the release of their new ECM63T transponder coil into the North American Automotive market for use in direct Tire Pressure Management Systems (�TPMS�) applications.
Industry News | 2010-09-01 12:43:24.0
Juki Corporation, a world-leading provider of automated assembly products and systems, will showcase its latest assembly systems in booth 7925 at the upcoming IPC Electronics Midwest Conference & Exhibition, scheduled to take place September 28-30, 2010 at the Donald E. Stevens Convention Center in Rosemont, IL.
Industry News | 2021-11-30 01:54:12.0
After more than 100 years of development, X-ray imaging technology has formed a relatively complete X-ray non-destructive testing (NDT) technology system. In order to meet these needs, new detection technologies are constantly innovating, using Xray inline inspection technology. It can not only detect invisible crack or porosity such as aluminum casting , but also qualitatively and quantitatively analyze the detection results to find flaws early.
Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu
Industry News | 2010-10-26 23:01:06.0
Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it has been awarded a Global Technology Award in the category of Placement Equipment-Low/Medium Volume for its JX-100LED.
