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Universal Instruments Universal AdVantis AC-30L SMT Placement

Universal Instruments Universal AdVantis AC-30L SMT Placement

Used SMT Equipment | Chipshooters / Chip Mounters

30 intelligent spindle assemblies      -> All vision processing is performed “on the fly” to maximize throughput.      -> Continuous updates of X, Y, and Z-height pickup and placement locations ● On-The-Head Cameras      -> narrow field of view c

Capital Equipment Exchange

LPKF ProtoMat H100 PCB Milling

LPKF ProtoMat H100 PCB Milling

New Equipment | Prototyping

Fully Automated for High-Performance Rapid PCB Prototyping Applications: Milling/drilling 1- & 2-sided PCBs Milling/drilling RF- & microwave substrates Multilayer PCBs up to 8 layers Contour routing circuit boards Flexible and

LPKF Laser & Electronics

SEHO North America to Showcase PowerWave and GoSelective at IPC Midwest 2011

Industry News | 2011-08-30 20:52:38.0

SEHO North America, Inc. will showcase the PowerWave and GoSelective in Booth #113 at the upcoming IPC Midwest Conference & Exhibition.

SEHO Systems GmbH

Dynatech Technology Adds Samsung Screen Printer SMP300 to Turnkey SMT Line

Industry News | 2007-06-11 10:27:17.0

Building on the successful SM Series of fast, flexible placement systems, Dynatech Technology has added the Samsung Screen Printer SMP300 System - used by Samsung worldwide to assembly consumer and industrial products - to expand its turnkey SMT capability for North American assemblers.

Hanwha Techwin CO., LTD.

NIKON Metrology Showcases the Inspect-X 4.1 Which Provides Ultra-Sharp Images And Advanced BGA analysis at Electronica Munich

Industry News | 2014-10-13 16:23:05.0

Nikon Metrology will be presenting Inspect-X 4.1 at Electronica Munich from 11-14 November, their latest release of the acquisition and analysis software for Nikon Metrology's range of X-ray and CT systems. The new technology provides improved real-time imaging and advanced BGA analysis.

Nikon Metrology, Inc.

Local fiducials

Electronics Forum | Mon Oct 25 05:52:34 EDT 2010 | sachu_70

In csae you use 2 fiducial recognition, ensure that board fiducials are oriented across a diagonal and spaced far apart. Also, maintain a prefered dia between 1-2 mm for the fiducial on board to have have a better correction factor recorded during fi

Re: Calculate SMD movement during reflow?

Electronics Forum | Wed Nov 03 20:02:44 EST 1999 | Anthony Winston

Well John here is the situation: I need to place an infrared transistor (optical element) with a tolerance of +/-.003", this is not a problem. A lens is positioned over the optical element and snapped to the PCB via three holes that have a toleran

0.5 mm pitch BGA

Electronics Forum | Wed Mar 02 06:19:03 EST 2005 | pjc

Go to http://www.ipc.org and look up IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components

0201 Land Pattern and Aperture Shape Design

Electronics Forum | Thu Mar 10 09:13:15 EST 2005 | davef

From http://www.IPC.org ... IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components, includ

SMT Production Tips

Electronics Forum | Sat Nov 26 00:02:17 EST 2011 | kevintough

I agree with this post about new and standard component names. Standard components should not be changed outside of perhaps widening the tolerance to accept poorly produced components. By purchasing poor quality/cheep components your purchasing depar

Sm t t net
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