Industry News | 2013-03-25 14:54:55.0
Aqueous Technologies, will present a cleaning and reliability workshop to address emerging trends in electronic assembly that have a significant impact on precision cleaning.
Industry News | 2017-10-24 17:17:49.0
Techcon today unveiled a new logo and brand identity at The Assembly Show in Rosemont, IL. The brand launch is being rolled out in conjunction with a series of innovative new products from Techcon, beginning with the TS550R Smart Valves Controller, which can remotely control the Techcon pneumatic valve series via mobile or desktop computer, or via intuitive touch screen controls.
Industry News | 2002-01-08 08:09:14.0
strategic outsourcing relationship
Industry News | 2003-02-28 08:54:32.0
Solectron to Provide Manufacturing Services for Surgical Robotic Equipment
Industry News | 2004-09-01 16:10:58.0
(article in French)
Industry News | 2010-08-19 02:11:40.0
Nordson Corporation announced that it has formed a test and inspection group within its Advanced Technology segment to better leverage the competencies of its Nordson DAGE and Nordson YESTECH subsidiaries.
Industry News | 2015-06-12 11:38:23.0
Combination Creates One of the Premier EMS Companies in the Mid-Tier Space
Industry News | 2004-02-03 04:25:42.0
Performance improvements position Valor to execute on major expansion plans.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
