Industry News | 2021-10-26 14:44:38.0
National Circuit Assembly (NCA) is proud to announce the formation of a strategic partnership with RSAE Labs. RSAE Labs is an industry-leading provider of global supply chain asset tracking, monitoring and security services for governmental agencies and enterprise companies. The NCA-RSAE Labs partnership is built upon a mutual desire to deliver cyber-secure IOT technology to improve management and production efficiency. NCA will be sourcing and manufacturing the suite of devices designed by RSAE Labs, as well as assisting in the design of future products. RSAE's flagship product is its 6th generation Global Sentinel™, a truly mobile IOT gateway with quad-redundant communications which enable efficient global supply chains. NCA's advanced design, manufacturing and sourcing resources will allow RSAE Labs to meet the growing global demand for resilient supply chain solutions by delivering dependable products with the highest cyber-secure standards.
Industry News | 2021-02-25 13:41:10.0
MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature their recent product releases and latest innovations, at the IPC APEX Virtual Conference and Expo, March 8-12, 2021.
Technical Library | 2017-01-05 16:55:11.0
The July 2006 implementation of ROHS exempted automotive applications from converting to lead free technology. Nine years later, all major OEM and Tier 1 automotive manufacturers have converted or are in the process of converting to lead free circuit assembly processing. Starting with SAC (SnAgCu) alloys as a baseline for lead free soldering, in the last years several specific alloys were developed in order to improve resistance to high temperature creep, vibration survival and the ability to withstand thermal cycling and thermal shock.The paper compares three different solder alloys and two flux chemistries in terms of void formation and mechanical / thermal fatigue properties. Void content and reliability data of the alloys will be presented and discussed in relation to the acceptance criteria of a Tier 1 /OEM automotive supplier. As a result, a ranking list will be presented considering the combined performance of the alloys. In order to analyze the void formation and mechanical behavior of different solder alloys and flux chemistry combinations, statistical methods are used.
Technical Library | 2022-10-31 17:09:04.0
The global transition to lead-free (Pb-free) electronics has led component and equipment manufacturers to transform their tin–lead (SnPb) processes to Pb-free. At the same time, Pb-free legislation has granted exemptions for some products whose applications require high long-term reliability. However, due to a reduction in the availability of SnPb components, compatibility concerns can arise if Pb-free components have to be utilized in a SnPb assembly. This compatibility situation of attaching a Pb-free component in a SnPb assembly is generally termed "backward compatibility." This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching Pb-free solder balls (SnAgCu) of a ball-grid-array component using SnPb paste. The experiment evaluates the Pb phase coarsening in bulk solder microstructure and the study of intermetallic compounds formed at the interface between the solder and the copper pad.
Industry News | 2009-11-25 14:13:34.0
SCHAFFHAUSEN, Switzerland, Nov. 24 /PRNewswire-FirstCall/ -- Tyco Electronics Ltd. (NYSE: TEL) today announced that the $0.16 per share quarterly dividend for the first fiscal quarter of 2010 will be payable on Dec. 23, 2009 to shareholders of record at the close of business on Dec. 15, 2009, subject to a required filing with the Swiss Commercial Register. The dividend was approved by shareholders in the form of a capital reduction at the company's special general meeting of shareholders held on Oct. 8, 2009.
Industry News | 2010-02-08 12:24:24.0
SCHAFFHAUSEN, Switzerland, Feb. 8 /PRNewswire-FirstCall/ -- Tyco Electronics Ltd. (NYSE: TEL) today announced that the $0.16 per share quarterly dividend for the second fiscal quarter of 2010 will be payable on March 17, 2010 to shareholders of record at the close of business on March 9, 2010, subject to a required filing with the Swiss Commercial Register.
Industry News | 2010-05-11 15:12:25.0
SCHAFFHAUSEN, Switzerland - Tyco Electronics Ltd. (NYSE: TEL) today announced that the $0.16 per share quarterly dividend for the third fiscal quarter of 2010 will be payable on June 16, 2010 to shareholders of record at the close of business on June 8, 2010, subject to a required filing with the Swiss Commercial Register.
Industry News | 2010-08-28 00:10:54.0
Tyco Electronics Ltd. (NYSE: TEL) today announced that the $0.16 per share quarterly dividend for the fourth fiscal quarter of 2010 will be payable on September 15, 2010 to shareholders of record at the close of business on September 7, 2010, subject to a required filing with the Swiss Commercial Register.
Industry News | 2002-05-01 09:41:08.0
OEM Agreement Calls for PPT VISION's SMI(TM) 3D Inspection Technology to be Integrated With Electroglas' World-Class Wafer Inspection Systems
Industry News | 2002-12-03 10:18:48.0
� World leading automotive electronics supplier enhances its PCB design process with the Enterprise 3000 platform
