Industry News | 2014-03-24 12:43:05.0
PORTLAND, MAINE – VisionMaster, Inc., a worldwide provider of 3D non-contact sensor systems, today announced that is has filed a civil lawsuit in Cumberland County Superior Court against ASC, International, of Medina, MN, to recover damages and to enjoin ASC from manufacturing and distributing counterfeit VisionMaster systems and other SPI systems based on pirated VisionMaster technology. The alleged pirated products are all 3D non-contact sensor systems sold by ASC since 2010, including those sold under both VisionMaster and VisionPro labels.
Industry News | 2003-05-28 04:56:42.0
World leading ESP chooses the Trilogy 5000 NPI solution to optimize process flow for PCB pre-production engineering
Industry News | 2020-07-09 18:44:44.0
Austin American Technology today announced their newest machine sale to AVANT Technology. The Texas based engineering and manufacturing company purchased the popular X30-A Stencil Cleaner from the X30™ Vertical Format Batch Cleaning Systems line.
Industry News | 2004-11-09 04:12:42.0
Enhancements include support for Siemens SMT equipment and new ICT Output Format
Industry News | 2014-05-07 16:11:10.0
AI Technology (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF), Combines High Glass Transition Temperature and Stress Absorption with Proven Thermal Performance in Die-Attach Power Dissipation.
Industry News | 2015-03-05 10:32:22.0
Gen3 Systems Limited is pleased to announce the company’s 30th anniversary. Since 1985, Gen3 Systems has been providing training and comprehensive in-house services for solderability, SIR, CAF and cleanliness testing.
Industry News | 2020-11-03 13:18:05.0
MacDermid Alpha Electronics Solutions announces the release of CircuEtch 200, a high performance anisotropic final etch for circuit formation in Semi-Additive and modified-Semi-Additive processes (SAP/mSAP) utilized in IC substrate and substrate-like HDI manufacturing.
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Industry News | 2003-10-15 13:56:33.0
Automates New Range of Circuit Types
Industry News | 2010-08-17 14:46:57.0
Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the immediate availability of Version 1.4 of its ispLEVER® Classic design tool suite. The ispLEVER Classic design software has been upgraded with the addition of Synopsys Synplify Pro with the HDL Analyst feature set, and an improved ispMACH® 4000ZE CPLD fitter with improved power optimization.
