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Microvias and Laser Technology Focus of IPC Printed Circuitd Expo 2002 Workshops

Industry News | 2001-11-27 13:09:48.0

IPC has announced its tutorial and workshop schedule for IPC Printed Circuits Expo 2002. A total of 34 courses are scheduled, including 15 full-day tutorials on March 24-25, and 19 half-day workshops, which will take place on March 25 and 28.

Association Connecting Electronics Industries (IPC)

Poll Finds Solder Finish, BGA Components and Reflow Soldering Most Challenging for Industry Engineers

Industry News | 2012-01-22 23:16:58.0

More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)

IPC and JPCA Release Industry’s First Design Guidelines for Printed Electronics

Industry News | 2013-07-31 07:28:30.0

Today, the electronics manufacturing industry’s first design guidelines for printed electronics, IPC/JPCA-2291, Design Guidelines for Printed Electronics, was released by IPC — Association Connecting Electronics Industries® and JPCA.

Association Connecting Electronics Industries (IPC)

Nordson ASYMTEK Presents Integrated Jetting Systems for Conformal Coating and PCBA at SMT Hybrid Packaging Nuremberg, Stand 7-109

Industry News | 2016-04-20 18:15:34.0

Nordson ASYMTEK will present a triple-valve, closed-loop system to jet conformal coating, a UV oven to cure it, and an automated coating inspection system to verify the coating results at the SMT Hybrid Packaging Show in Nuremberg, Germany, in the smartTec stand 7-109 from 26-28 April 2016. Nordson ASYMTEK's award-winning Quantum® Q-6800 high-performance, large-format dispensing system will jet underfill as part of the show's Future Packaging Line at stand 6-434.

ASYMTEK Products | Nordson Electronics Solutions

IPC Inducts Two Long-Time Volunteers into Hall of Fame Ray Prasad and Lionel Fullwood Join Illustrious Rank

Industry News | 2013-02-19 18:26:34.0

In recognition of their extraordinary contributions to IPC and the electronic interconnect industry, Ray Prasad, Ray Prasad Consultancy Group and Lionel Fullwood, WKK Distribution Ltd., were honored with the IPC Raymond E. Pritchard Hall of Fame Award.

Association Connecting Electronics Industries (IPC)

Volunteers Honored for Contributions to Electronics Industry and IPC More than 80 Awards Presented at IPC Midwest

Industry News | 2012-08-22 15:57:01.0

IPC – Association Connecting Electronics Industries® presented Special Recognition, Distinguished Committee Leadership and Committee Service Awards at IPC Midwest Conference & Exhibition

Association Connecting Electronics Industries (IPC)

Is Stress the Root of Tin Whisker Growth? Brown University professor and other experts to present research at 7th International Tin Whiskers Symposium

Industry News | 2013-11-01 16:09:44.0

Eric Chason, Ph.D., professor of engineering at Brown University, will present his tin whisker research at the 7th International Tin Whiskers Symposium, November 12–13 in Costa Mesa, Calif., hosted by IPC with academic partner CALCE.

Association Connecting Electronics Industries (IPC)

IPC-2581 Consortium Member Fujitsu Successfully Fabricates Multi-Layer PCB from IPC-2581B Design File

Industry News | 2016-04-07 08:47:23.0

The electronics industry has never settled on a single approach for moving printed board design data to manufacturing. With the release of IPC-2581B, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology, design engineers now have a way to organize and convey printed circuit board designs from CAD tools in a single intelligent file to manufacturing for fabrication, assembly and test.

Association Connecting Electronics Industries (IPC)

Updated Materials Declaration Standard IPC-1752A Addresses Revolving Door of Environmental Regulation Changes.

Industry News | 2010-04-10 02:22:08.0

Helping electronics manufacturing companies better manage the growing documentation required to ensure products comply with evolving environmental regulations, IPC — Association Connecting Electronics Industries® has released IPC-1752A, Materials Declaration Management. The A revision of the standard provides an updated and expanded industry-wide reporting format for material declaration data exchange between companies in the electronic interconnect supply chain.

Association Connecting Electronics Industries (IPC)


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