Industry Directory | Distributor / Manufacturer
Design and manufacturing thick film printing machine for HIC,LTCC,HTCC,chip components,sensors,professional equipment provider,thick film printer,furnace, dryer,laser trimming,thick & thin film technology.
New Equipment | Solder Materials
eFlux Selection: Rosin Based Flux for Lead-Free Wave Soldering NS-F850. NS-F850 ensures excellent wetting of all PCB and component substrates to deliver maximum through hole fill and facilitates the solder drainage that ensures minimum bridges an
Sono-Tek's Selective Fluxing Systems provide excellent fine-line control and through-hole penetration for maximizing top-side fill. Compatible with all fluxes, our non-clogging ultrasonic nozzle technology is known worldwide as the industry standard
BLIND RIVETS 'REX' BLIND RIVETS, a range of high speed industrial fasteners are easily installed in blind or open applications, offer high clench, fill up over size holes, offer one length per dia-reducing stock holding, can be used on finished surf
'REX' BLIND RIVETS, a range of high speed industrial fasteners are easily installed in blind or open applications, offer high clench, fill up over size holes, offer one length per dia-reducing stock holding, can be used on finished surfaces, gives hi
'REX' BLIND RIVETS, a range of high speed industrial fasteners are easily installed in blind or open applications, offer high clench, fill up over size holes, offer one length per dia-reducing stock holding, can be used on finished surfaces, gives hi
'REX' BLIND RIVETS, a range of high speed industrial fasteners are easily installed in blind or open applications, offer high clench, fill up over size holes, offer one length per dia-reducing stock holding, can be used on finished surfaces, gives hi
Industry Directory | Manufacturer
A printed circuit board manufacturer producing high quality prototype printed circuit boards.
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
SonoFlux 2000F is a stationary spray fluxing system for coating Printed Circuit Boards with a uniform thin film layer of flux. Features include excellent through hole penetration for maximum top side fill, non-clogging, self cleaning ultrasonic nozzl
