Full Site - : fillet (Page 13 of 84)

Nihon Superior to Premier New SN100C Products at APEX 2009

Industry News | 2009-03-10 16:11:29.0

OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it will showcase a new, expanded range of SN100C products in booth 2564 at the upcoming APEX exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.

Nihon Superior Co., Ltd.

Nihon Superior to Exhibit Advanced Soldering Materials at INTERNEPCON JAPAN 2011

Industry News | 2011-01-14 13:06:07.0

Nihon Superior Co. Ltd. will exhibit in Booth # East 30-14 at the upcoming INTERNEPCON JAPAN, scheduled to take place January 19-21, 2011 at the Tokyo Big Sight in Tokyo, Japan.

Nihon Superior Co., Ltd.

Nihon Superior to Showcase Advanced Soldering Materials at IPC APEX EXPO 2011

Industry News | 2011-03-14 17:59:18.0

Nihon Superior Co. Ltd. will exhibit in Booth #259 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.

Nihon Superior Co., Ltd.

Nihon Superior to Address Key Industry Trends, Concerns at the SMTA Ohio Valley Chapter Meeting

Industry News | 2011-05-16 16:00:12.0

Nihon Superior announces that Keith Howell, Technical Director for the Americas, will present during the SMTA Ohio Valley chapter meeting on June 3, 2011 at the Dave and Busters in Hilliard, Ohio.

Nihon Superior Co., Ltd.

Nihon Superior to Introduce the Newest Addition to the SN100C Lead-Free Solder Series at SMTAI 2011

Industry News | 2011-09-21 12:22:09.0

Nihon Superior will introduce the newest addition to its SN100C lead-free solder series, in Booth #310 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.

Nihon Superior Co., Ltd.

Nihon Superior to Exhibit Range of Innovative Products at the 2013 IPC APEX EXPO

Industry News | 2013-01-16 08:45:06.0

Nihon Superior Co. Ltdwill introduce a range newly developed products that offer solutions for some of the challenges the electronics industry is now facing, lead-free die attach, void minimization, environmental protection, and process yields.

Nihon Superior Co., Ltd.

New release of a space-saving compact substrate inspection machine (AOI/SPI) “RV-2”

Industry News | 2015-10-06 19:39:34.0

JUKI released a space-saving compact PWB Inspection Machine "RV-2" at home and abroad in March 18. As a single-lane inspection machine, "RV-2" inherits the high-accuracy inspection capability of the high-end PWB Inspection Machine RV-1. This is an in-line type high-precision PWB inspection machine in space saving compact design.

Juki Automation Systems

TopLine’s Micro-coil Springs (MSC) for CCGAs in Harsh Environments Featured at IPC/APEX EXPO 2017

Industry News | 2017-01-29 09:37:08.0

TopLine will exhibit its MSC Series of Micro-coil springs, a novel interconnect for CCGA (Ceramic Column Grid Array) IC packages for harsh environments. In tests using daisy chain test vehicles, Micro-coil springs absorbed extreme shock of up to 50,000g before failing. Commercial applications include aerospace, avionics, military, down-hole oilfield drilling and automotive electronics. Test results were initially presented at IEEE CPMT 2012.

Speedline Technologies, Inc.

Koh Young Exhibiting its Industry-leading 3D Inspection Solutions at SMT Hybrid Packaging 2018

Industry News | 2018-05-14 09:06:17.0

Under the slogan “True 3D Smart Factory solutions powered by the AI platform,” Koh Young Technology will exhibit in Hall 4A, Booth 233, at the upcoming SMT Hybrid Packaging show scheduled for June 5-7, 2018 at the Messe in Nuremberg, Germany. The company will display the next-generation Zenith2 3D AOI, new KY-P3 3D pin inspection solution, and the new automated solder dispensing feature on its KY8030-3 3D SPI.

Koh Young America, Inc.

Koh Young Exhibiting its Industry-leading 3D Inspection Solutions at SMT Hybrid Packaging 2018

Industry News | 2018-05-14 09:06:21.0

Under the slogan “True 3D Smart Factory solutions powered by the AI platform,” Koh Young Technology will exhibit in Hall 4A, Booth 233, at the upcoming SMT Hybrid Packaging show scheduled for June 5-7, 2018 at the Messe in Nuremberg, Germany. The company will display the next-generation Zenith2 3D AOI, new KY-P3 3D pin inspection solution, and the new automated solder dispensing feature on its KY8030-3 3D SPI.

Koh Young America, Inc.


fillet searches for Companies, Equipment, Machines, Suppliers & Information

Global manufacturing solutions provider

High Precision Fluid Dispensers
Blackfox IPC Training & Certification

Wave Soldering 101 Training Course
SMT feeders

World's Best Reflow Oven Customizable for Unique Applications
Selective soldering solutions with Jade soldering machine

Training online, at your facility, or at one of our worldwide training centers"
Best SMT Reflow Oven

High Resolution Fast Speed Industrial Cameras.


"回流焊炉"