Full Site - : fillet length (Page 2 of 4)

1206 Cap on 0805 Pad/Land

Electronics Forum | Thu Jan 24 04:54:43 EST 2002 | wbu

Well Greg, I don�t know YOUR 0805 Pads but if you look at the recommended pattern for 0805 in IPC-SM-782 you might notice that the Z-dimension is somewhat about the size of your 1206 part length. With that and assuming that you ask if the results wi

Re: Trimming leads

Electronics Forum | Sat Feb 05 14:51:08 EST 2000 | Bill Petlock

Casimir, The Q and other lead trimmers work extremely well if properly used. Blade life is directly proportional to to the height of the cut. There are a few factors that are very important in trimming. You are working with a solid carbide blade whi

Re: Land Pattern Design for PLCC's, QFP's etc... in Full Radius Corners

Electronics Forum | Wed Mar 29 22:30:13 EST 2000 | cklau

Hi guys; There are a few points that should be taken in to considerations regarding IPC-SM-782 land pattern and design rules. As a general rule all SMT reflow pattern should be in comply with SM-782 but however for special cases like : * PLCC land

25 mil QFP soldering issue

Electronics Forum | Thu Aug 05 05:23:13 EDT 2004 | Bryan

Hi All,per my understanding ,the fail mode is the heel fillet of QFP seems no good,right?If yes...I think..we should:1.increase the aperture length on stencil and make sure there's enough solder paste on pad before reflow. or you can increase your t

Non-wetting: PTH on double-side reflow

Electronics Forum | Wed Apr 06 11:10:47 EDT 2005 | smt_rookie

We process a double-side reflow board (10 ups). Chips and IC's on the bottom side while chips, IC's plus thru-hole connectors and IC sockets on top side (bottom side first then top side reflow). In the past, we were not encountering any soldering pro

compactflash memory process requirements

Electronics Forum | Sun Apr 21 19:56:57 EDT 2002 | francis khoo

Hello Pete, Very true about the heel fillet. Looks like the pad at pcb has to be designed such that the pad should extend at heel but short at toe. About the encapsulation. I can understand the requirements. Can you provide me with a more detail proc

Re: Second wave elimination

Electronics Forum | Sat Feb 05 09:13:39 EST 2000 | Dave F

Hany: In response to your questions: 1- In a double wave solder M/C, is possible to completely eliminate the second wave without affecting the quality of the solder joints? Many w/s machines have a turbulent wave and a smooth wave. The turbule

Can we hide extra long pad with solder mask ?

Electronics Forum | Fri Nov 09 11:55:49 EST 2001 | mparker

If you are getting solder shorts under a device, how would "hiding" the extra long pad with solder mask help? If the pad can't be seen once the device is in place, it is already "hidden". Getting your customer to redesign the pads may take some time

Re: Closer lead more soldering bridge by using spray flux

Electronics Forum | Tue Jun 08 12:49:41 EDT 1999 | Dave F

| Hi,my master | How to iron out such soldering bridge with below conditions: | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | 3.using spraying fluxer and n

Re: Closer lead more soldering bridge by using spray flux

Electronics Forum | Tue Jun 08 13:06:53 EDT 1999 | Kevin Hussey

| | Hi,my master | | How to iron out such soldering bridge with below conditions: | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | 3.using spraying fl


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