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Precautions for Welding Stainless Steel Pipe
Electronics Forum | Thu Apr 12 20:32:31 EDT 2007 | davef
On one hand, nothing in 8.2.5.4 that states that you need a heel fillet. It only talks to the length of the side fillet. On the other hand, we suggest that you should use 8.2.5.6 to determine if your heel fillet is acceptable, after you have determ
Electronics Forum | Mon Jul 31 03:50:26 EDT 2023 | calebcsmt
Is below the correct interpretation of IPC 610/JSTD requirements for FLAT LUG LEADS (seen on USBs and Diodes mainly) For class 1 or 2, no toe wetting would be required as minimum side joint is only 'evident wetting' and no actual length or fillet he
Electronics Forum | Mon Jan 29 10:57:16 EST 2007 | davef
Maybe your customer ment to say something like: reliability in actual use does to a large extent depend on the heel fillet and the 'bottom flat' wetting. If the foot length is
Electronics Forum | Thu Mar 22 17:31:08 EST 2001 | davef
Hold off on the sharp knife for little bit. [Yano, I get "queasy" when I see much of my blood, but other people�s blood doesn�t bother me much. Weird, eh?] [Oh bye-da-bye, I didn�t win the bar bet on "Ground Hog Day". I didn�t loose it either. T
Electronics Forum | Thu Apr 12 20:44:58 EDT 2007 | raychamp007
If the solder joint meeting 8.2.5.4, minimum side joint length(D) and also meeting 8.2.5.6, minimum heel fillet height (F) but the heel fillet NOT extend to the mid point of outside bend. It is acceptable?
Electronics Forum | Thu Nov 07 12:35:38 EST 2002 | slthomas
Sounds like you're talking about the "heel" of the lead not being soldered, in other words, no heel fillet, which IS necessary. That problem, for us, was attributed primarily to poor layout (insufficient length of pad extension to provide room for
Electronics Forum | Mon Mar 26 20:55:16 EST 2001 | davef
Two things: 1 IPC pad calculator is an excellent resource for you and your board layout staff. Consider that working together with the calculator may allow you both an opportunity to balance your interests. 2 It's unlikely that the ceramic parts h