Industry Directory | Manufacturer
IRC has been a leader in resistor technology, including the industry's comprehensive range of current sense resistors, precision discrete and networks, integrated passive components, and specialized power resistors.
Industry Directory | Manufacturer
Manufacturer of Passive Hybrid Microelectric Components. Resistors, Capacitors, Inductors, Resistor
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Automatic SMT Splicing Machine BMM08G/G_Plus Functional advantages ▶Simple operation: 5 minutes to learn to operate, everyone can operate, reducing dependence on personnel. ▶Foolproof and error-proof: Automatically scan the code to compare and prev
General Purpose (SMT and Leaded Styles): Thick Film Chips and Arrays (SMT), NTC Chip Thermistors (SMT), Carbon Film (LD), Metal Film (LD), Metal Oxide Film (LD) and SIP Networks (LD)
Electronics Forum | Wed Apr 26 06:09:12 EDT 2017 | ajaytyagi
Hi, Pl let me know about opinion/experience whether thick film chip SMD resistor which is MSL-1 Required to bake before being usedon SMT line. I want to use SMD resistance spool which is around 2 yeasr old kept at 25 deg room temperature at around 4
Electronics Forum | Thu Apr 27 02:39:50 EDT 2017 | ajaytyagi
Thanks for sharing your experience. I have similar view too.
Used SMT Equipment | Pick and Place/Feeders
JUKI high-speed Mounter machine. suitable for LED and large LCD backlight production. JUKI High Speed Mounter JX-350 Features: Chip Components: 32,000 CPH (Optimum Conditions)&n
Used SMT Equipment | Soldering - Reflow
The SMRO-4000 Scirocco Reflow oven has been developed for reflow soldering of Hybrid boards, SMT boards and Curing Glue or thin film pastes. The machine is developed for medium to large series of assembly. The Scirocco is based on hot air convection.
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Parts & Supplies | Chipshooters / Chip Mounters
MPM ACCUFLE SQUEEGEE BLADES 220mm Other MPM parts we supply: MPM AccuFlex metal film scraper 150mm/220mm/250mm MPM AccuFlex metal film scraper 260mm/300mm/330mm MPM AccuFlex metal film scraper 360mm/420mm/430mm MPM AccuFlex metal film scraper 46
Parts & Supplies | Chipshooters / Chip Mounters
MPM ACCUFLE SQUEEGEE BLADES 150mm Other MPM parts we supply: MPM AccuFlex metal film scraper 150mm/220mm/250mm MPM AccuFlex metal film scraper 260mm/300mm/330mm MPM AccuFlex metal film scraper 360mm/420mm/430mm MPM AccuFlex metal film scraper 46
Technical Library | 2020-01-15 23:54:34.0
Flexible electronics has significantly advanced over the last few years, as devices and circuits from nanoscale structures to printed thin films have started to appear. Simultaneously, the demand for high-performance electronics has also increased because flexible and compact integrated circuits are needed to obtain fully flexible electronic systems. It is challenging to obtain flexible and compact integrated circuits as the silicon based CMOS electronics, which is currently the industry standard for high-performance, is planar and the brittle nature of silicon makes bendability difficult. For this reason, the ultra-thin chips from silicon is gaining interest. This review provides an in-depth analysis of various approaches for obtaining ultra-thin chips from rigid silicon wafer. The comprehensive study presented here includes analysis of ultra-thin chips properties such as the electrical, thermal, optical and mechanical properties, stress modelling, and packaging techniques. The underpinning advances in areas such as sensing, computing, data storage, and energy have been discussed along with several emerging applications (e.g., wearable systems, m-Health, smart cities and Internet of Things etc.) they will enable. This paper is targeted to the readers working in the field of integrated circuits on thin and bendable silicon; but it can be of broad interest to everyone working in the field of flexible electronics.
Technical Library | 2013-12-05 17:09:03.0
The functionality of electronic devices continues to increase at an extraordinary rate. Simultaneously consumers are expecting even more and in ever smaller packages. One enabler for shrinking electronics has been the flexible circuit board that allows the circuit board to fit a wide variety of shapes. Flexible printed circuits (FPC) have the capability to be very thin and can have unpackaged components directly attached using surface mount technology (SMT) and flip chip on flex technologies. Bare die can also be thinned and attached very close to the circuit board. However one caveat of high density flexible circuit boards with thin die is that they can be very fragile. The use of back side films and underfill can protect the die making circuits more robust. For underfill to work well it requires good adhesion to the circuit board which can mean that flux residues under the die normally must be removed prior to underfilling.
http://yincae.com/index.html YINCAE SMT 256 Dipping Process YINCAE SMT 266 Jetting Process
Events Calendar | Wed Jul 03 00:00:00 EDT 2024 - Wed Jul 03 00:00:00 EDT 2024 | ,
Europe Chapter Webinar: "Back-to-Basics" SMT Assembly
Career Center | Melbourne, Florida USA | Engineering,Research and Development
Harris Corporation (NYSE-HRS) is an international communications equipment company focused on providing product, system, and service solutions that take its customers to the next level. The company provides wireless, broadcast, government, and networ
Career Center | Boulder, Colorado USA | Engineering,Production,Quality Control
Senior-level micro-electronic technician capable of independent manufacture of custom hybrids, focal plane assemblies, and prototype detector assemblies in cleanroom environment (in Advanced Packaging and Detector Laboratory). MINIMUM QUALIFICATIONS
Career Center | bangalore, India | Management
• Hands on experience in planning functions i.e. material planning, scheduling, inventory management. • We have a good knowledge of BOM, KANBAN, MIN-MAX order quantity, • We have Good knowledge in ERP Baan System , • Demand adjustment as per cu
Career Center | Shen Zhen, China | Management,Sales/Marketing
Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe
SMTnet Express, January 16, 2020, Subscribers: 33,604, Companies: 10,962, Users: 25,521 Ultra-Thin Chips For High-Performance Flexible Electronics Credits: Bendable Electronics and Sensing Technologies (BEST) Flexible electronics has significantly
| http://etasmt.com/cc?ID=te_news_bulletin,23572&url=_print
solder film and the base metal is not exposed. Process and design-related causes: • Solder paste flux not aggressive enough for level of oxidation present on part or PCB
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/products/applicators?con=t&page=4
ASYMTEK Select Coat SC-204/205 Film Coater Applicator for Select Coat SL-940 System Nordson ASYMTEK Flow Monitoring System for Select Coat SL-940 System Nordson ASYMTEK Underfill Dispensing for Chip On
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