Industry News | 2009-12-08 15:08:44.0
Reinhausen Plasma will be presenting the first ever cold-active plasma tools at the productronica – the Plasmabrush, Piezobrush and Plasmadust. The innovative Plasmabrush and Piezobrush open up a whole range of new application fields with regard to the pre-treatment and activation of substrate surfaces.
Industry News | 2009-12-08 14:33:47.0
The compact, portable handset for cost-effective plasma surface activation.
Industry News | 2013-01-29 16:22:57.0
International Manufacturing Services introduces their line of HVI Series chip resistors especially suited for high voltage applications.
Industry News | 2021-05-11 15:06:26.0
New CDE-Illinois DC Link Capacitor Series Offers Low-Profile Mounting in a High-Capacitance, High-Voltage Film Capacitor
Industry News | 2010-11-04 12:19:39.0
Krayden, Inc., a leading distributor of engineered materials, introduces Henkel’s Frekote 55-NC, an improved version of the Frekote 44-NC, offering quicker evaporation times and less odor.
Industry News | 2021-08-02 14:05:26.0
New Yorker Electronics supplies Cornell Dubilier CDE BLH Series DC Link Capacitors for Long Life, High Power Density and Low ESR Designed for Harsh Environments
New Equipment | Solder Materials
AuSn solder electroplating is a key technology developed by Micralyne to lower your production costs and give you a better MEMS product. This state-of-the-art, patented process for electroplating AuSn solder alloy is a giant step forward in electropl
Variable Resistive Inks (VRI) Electrically Conductive Screen Printable Inks Outstanding Mechanical Abrasion Resistance The VRI product line is composed of several inks having different precision resistance values so custom blending for intermedia
355nm 10W /15W High-Precision CCD FPC/PCB UV Laser Cutting Machine With Perfect CAM interface, it supports the mainstream of the drilling and milling file format; man-machine interface is friendly; optical path is sealed, and it also has stable an
Industry News | 2023-10-30 19:21:14.0
Tresky GmbH from Hennigsdorf near Berlin will present various metallic pre-sintering processes, including the Die Transfer Film (DTF) process, at this year's productronica 2023 in Munich. Especially for bonding semiconductors such as IGBTs, SiC MOSFETs or GaN HEMTs with Ag on DBC or AMB substrates or for connecting power modules on heat sinks, metallic sintering offers a high-performance solution with maximum reliability.
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
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