Features & Application: 1) Material: polyimide film 2) Imported organic silicone pressure - sensitive adhesive is introduced 3) High temperature resistant 4) Acid and alkaline resistant 5) Solvent resistant 6) Electrical insulation (Grade H) 7) Radia
The BEST PCB pad repair repair kit gives you the tools you need for fast modification and repair of PCB circuit pads-no matter what their size. Our online PCB repair training videos, our master instructors along with these materials allows you to mee
The BEST PCB pad repair repair kit gives you the tools you need for fast modification and repair of PCB circuit pads-no matter what their size. Our online PCB repair training videos, our master instructors along with these materials allows you to mee
Industry News | 2024-05-31 00:29:12.0
Out-mold decoration (OMD) is an innovative extension of in-mold decoration. It can be applied in both metal and plastic parts.
If you are interested in our this product, please see more at http://www.cheersonic-liquid.cn/uam6000-ultrasonic-spraying-machine/ Ultrasonic spraying technology provides a cost-effective and efficient spraying method for the package-level EMI shie
Ultrasonic spraying equipment is a spraying equipment developed specifically for glass, thin film batteries, touch screens, fuel cells, nano materials, etc. It has the advantages of high spraying efficiency, low flow rate (controllable), uniform spra
New Equipment | Test Equipment
The Micro Scratch Tester is widely used to characterize adhesion failure of thin films and coatings, with a typical thickness below 5 µm. The MST is also used in the analysis of organic and inorganic; soft and hard coatings. Applications include thin
Technical Library | 2023-02-13 19:23:18.0
Spontaneously forming tin whiskers, which emerge unpredictably from pure tin surfaces, have regained prevalence as a topic within the electronics research community. This has resulted from the ROHS-driven conversion to "lead-free" solderable finish processes. Intrinsic stresses (and/or gradients) in plated films are considered to be a primary driving force behind the growth of tin whiskers. This paper compares the formation of tin whiskers on nanocrystalline and conventional polycrystalline copper deposits. Nanocrystalline copper under-metal deposits were investigated, in terms of their ability to mitigate whisker formation, because of their fine grain size and reduced film stress. Pure tin films were deposited using matte and bright electroplating, electroless plating, and electron beam evaporation. The samples were then subjected to thermal cycling conditions in order to expedite whisker growth. The resultant surface morphologies and whisker formations were evaluated.
Industry Directory | Manufacturer
Broadline Supplier Of Surface Mount/Leaded Capacitors, Resistors, Magnetics, MLVs And Diodes
Industry Directory | Manufacturer
DEM develops and markets highly sophisticated materials used in the electronic materials segment of the global electronics value chain.
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
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