Industry Directory | Manufacturer
Vexos China offers full turnkey electronics manufacturing solutions from printed circuit board assembly to final mechanical assembly, test, box build, and shipping of finished products to Local and Global OEMs in multiple markets.
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Endodontic NiTi File Manufacturing Machine Supply || Grinder || Assembly || Heat-treatment Your Gateway to Endo Niti File Manufacturing Excellence!
Jet printing for high mix production The MY500 Jet Printer is a breakthrough innovation. Well proven on five continents, it shoots solder paste on the fly at split-second speeds while moving above the board. The MY500 is designed to keep pace with
Technical Library | 2015-12-02 18:32:50.0
(Thermal Compression with Non-Conductive Paste Underfill) Method.The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar micro-bump and TCNCP is one of the platform technologies, which is essentially required for 2.5D/3D chip stacking as well as cost effective SFF (small form factor) package enablement.Although the baseline packaging process methodology for a normal pad pitch (i.e. inline 50μm) within smaller chip size (i.e. 100 mm2) has been established and are in use for HVM production, there are several challenges to be addressed for further development for commercialization of finer bump pitch with larger die (i.e. ≤50μm tri-tier bond pad with the die larger than 400mm2).This paper will address the key challenges of each field, such as the Cu trace design on a substrate for robust micro-joint reliability, TCNCP technology, and substrate technology (i.e. structure, surface finish). Technical recommendations based on the lessons learned from a series of process experimentation will be provided, as well. Finally, this technology has been used for the successful launching of the company FPGA products with SFF packaging technology.
Technical Library | 2018-09-26 20:33:26.0
Bottom terminated components, or BTCs, have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations with underside ground/thermal pads have presented a multitude of challenges to PCB assemblers, including tilting, poor solder fillet formation, difficult inspection and – most notably – center pad voiding. Voids in large SMT solder joints can be difficult to predict and control due to the variety of input variables that can influence their formation. Solder paste chemistries, PCB final finishes, and reflow profiles and atmospheres have all been scrutinized, and their effects well documented. Additionally, many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.
New Equipment | Board Handling - Conveyors
SMT PCB Conveyor Or Conveyor with lighting option, the professional SMT manufacturer Product Technical Specification: Brand ZH-Rainbow Model ZH-808 Conveyor Outer Dimension Rail length *640*910mm PCB Width 50~350mm PCB Direction L to R or R t
Industry News | 2012-02-10 16:23:40.0
SEMA announces it will host the IPC Solar/PV standards meeting on Final Module Visual Inspection, Tabbing and Stringing and Lamination, scheduled to take place Tuesday, February 14, 2012 at the Wyndham Hotel on North First Street in San Jose, CA.
Training Courses | ON DEMAND | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Industry Directory | Manufacturer
CPC Technologies Ltd. We are specializing in the Printed Electronics field, as well as in the Touch Panel/membrane switch manufacturing.
Industry Directory | Manufacturer
A pioneer in the Wire Harness industry in the 1980s,Our Core Production consists of Wire Harness and Cable Assembly,Rubber and Small Plastic Molding, PCB Assembly and Complete Finish Product Box Build
