Industry News | 2021-02-25 13:41:10.0
MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature their recent product releases and latest innovations, at the IPC APEX Virtual Conference and Expo, March 8-12, 2021.
Industry News | 2015-09-22 20:41:43.0
ASC International today announced that its VisionPro HSi will be featured in the SMTA International – National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience from Sept. 29-30, 2015 on the show floor. The experience is free to attend and is supported by CIRCUITS ASSEMBLY Magazine, SMTA and NPL.
Industry News | 2008-10-07 12:56:56.0
APS Novastar introduces automatic Vision Control for its L-Series pick and place systems. Vision Control advances the already precise, fast and reliable placement of 0201's with 100% accurate on-the-fly, bottom-up vision placement of micro BGA's and ultra fine pitch QFP's.
Industry News | 2016-04-05 11:30:08.0
This mornings webinar was conducted on fine pitch rework and repair and include a survey of 72 company's. The recording is available on line at and a copy of the slides and survey results can be obtained direct from Bob Willis bob@bobwillis.co.uk
Technical Library | 2013-03-04 16:51:00.0
Chip-scale (or chip-size) packages are rapidly becoming an important element in electronics due to their size, performance, and cost advantages [Hou, 1998]. The Chip Scale Package (CSP) is becoming a key semiconductor package type, particularly for consumer products. Due to their relatively smaller size, new challenges are presented in the rework and repair of CSPs. (...) The specific focus of this paper is the removal process for rework of CSPs and the site scavenging methods required to properly prepare the circuit board for a new component. Process factors such as the heating, fluxing and, atmosphere are discussed.
Industry News | 2017-05-01 14:53:34.0
ITW EAE’s Vitronics Soltec earned two coveted VA Excellent Awards from the SMT China Vision Awards at the recent NEPCON China exposition and conference in Shanghai. The CATHOX™ Catalytic Thermal Oxidizer was recognized in the Reflow Soldering category and the ZEVAm took the prize in the Selective Soldering category.
Technical Library | 2023-07-25 16:42:54.0
Printing solder paste for very small components like .3mm pitch CSP's and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields, SMT Connectors, and large chip or resistor components are also present on the PCB. The smaller components require a stencil thickness typically of 3 mils (75u) to keep the Area Ratio greater than .55 for good paste transfer efficiency. The larger components require either more solder paste height or volume, thus a stencil thickness in the range of 4 to 5 mils (100 to 125u). This paper will explore two stencil solutions to solve this dilemma. The first is a "Two Print Stencil" option where the small component apertures are printed with a thin stencil and the larger components with a thicker stencil with relief pockets for the first print. Successful prints with Keep-Outs as small as 15 mils (400u) will be demonstrated. The second solution is a stencil technology that will provide good paste transfer efficiency for Area Ratio's below .5. In this case a thicker stencil can be utilized to print all components. Paste transfer results for several different stencil types including Laser-Cut Fine Grain stainless steel, Laser-Cut stainless steel with and w/o PTFE Teflon coating, AMTX E-FAB with and w/o PTFE coating for Area Ratios ranging from .4 up to .69.
Industry News | 2010-04-10 23:59:50.0
LOS ALAMITOS, CA - Following the success of their 2007 test board and kit, Practical Components and Aim Solder have updated their offering with a new AIM print test board and kit that is designed to include many printing challenges commonly found in manufacturers' assemblies.
Industry News | 2009-03-01 22:13:07.0
OSAKA, JAPAN � February 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces Extra Fine Solder Wire SN100C (030) provides sharp spreading and good separation.
Industry News | 2011-10-09 01:24:32.0
Well established Rep Groups will help expand the SIPAD presence in The Midwest and Southeast
