BEST Inc master instructor Norman Mier demonstrates how to replate gold fingers using the BEST gold contact replating kit. In this video he demonstrates how to repair, prepare and replate the finger using a gold replating solution. If you want to lea
Industry News | 2014-01-17 12:52:25.0
BEST Inc., has developed a line of Kapton™ SMT stencils for the prototype assembly market. These stencils, available in 4,5 and 6 thicknesses, present very flat coplanar printing surfaces for solder paste printing. . They are designed to be used when the there are very few boards to be made at one time and the pitch of the components is 1.00 and above.
We provide Bga rework station and X-ray inspection machine for SMT. For more information , please contact Rita Li by: whatsapp:0086 134 3448 1030 Skype:ritaleeli Seamark Zhuomao Fine pitch LED repairing equipment ZM-R720 for beads soldering and
Industry News | 2018-02-27 08:52:09.0
Mycronic AB will together with Optomec Inc. exhibit a newly co-developed micro dispensing platform for electronics materials at IPC APEX EXPO 2018. Technology trends are creating new challenges where material deposition must not only be precise but also be dispensed at micrometer scale geometries. Leveraging Optomec’s unique, high-resolution Aerosol Jet technology onto Mycronic’s MYSmart precise dispensing platform creates a production-viable solution for micro dispensing and printed electronics.
Industry News | 2018-03-05 15:57:39.0
Mycronic AB (publ), will together with Optomec Inc. exhibit a newly co-developed micro dispensing platform for electronics materials at IPC APEX EXPO in San Diego, February 27 - March 1, 2018.
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
PC boards and kits for machine set-up and calibration, hand solder training, rework, practice, testing and more along with a drawing of each PCB. Practical has a PCB board or kit to meet your requirements. BGA Fine Pitch, Global Daisy-Chain or Vari
Automatic Pick and Place TP50V Product Description: TP series is a fully automatic vision SMT pick and place machine, it can mount a variety of components through the vacuum nozzle can be mounted .it is the most cost effective automatic placement e
Automatic Pick and Place TP50V Product Description: TP series is a fully automatic vision SMT pick and place machine, it can mount a variety of components through the vacuum nozzle can be mounted .it is the most cost effective automatic placement e
