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Used SMT Equipment | Pick and Place/Feeders
Sku 16530 • Latest Tpsys 5.1.1 software in July of 2020• Upgraded from PF3 to PF4 CPU• Upgraded VVG2 ED-3D board • Rated Speed 15 000 CPH • Chip Net Throughput 13 500 CPH• Fine Pitch Accuracy @ Cpk = 1.33 (X, Y, Theta) 35 μm, 0.09º• Fine Pitch Repea
SemiPack's capabilities range from fully automatic to manual processing; extensive cropping and forming capabilities; active and passive component processing; axial to radial lead forming servicing; and snap-in and stand-off forms. For SMT processi
Seamless Delivery to the Marketplace. The smooth flow of our services continues through to assembly. Our vertically integrated services allow customers to implement engineering changes dynamically. Our fully expandable information system provides fo
CAPABILITIES Top and bottom side Fine pitch BGA PCB Design and PCB Layout of Prototype builds Testing HP 3070 Checksum ICT MEC custom PCB Design and PCB Layout Functional and final test X-ray Special Processes Encapsulation (potting) Confo
Up to 4500 pph with fine pitch capabilities starter package includes: 12 tape feeders ,fine pitch squaring station, teach camera and Pentium computer for $29,975.00
Up to 3500 pph with fine pitch capabilities starter package includes: 12 tape feeders ,fine pitch squaring station, teach camera and Pentium computer for $19,975.00
The long-term inspection solution for wave, reflow, pre-reflow and selective soldering. In the manufacturing of electronic assemblies, optimization of the production processes is a major factor in the success of producing to the high demands of qual
New Equipment | Solder Paste Stencils
Repair stencils and Reballing stencils in a lasercuting and laserwelding production process Since more than 10 years LaserJob is manufacturing repair stencils in a lasercut and laserwelding process. With the introduction of the SMD – Technology the
1.Product Introduction The third generation model TM245P is NeoDen Tech’s independent product,with completely independent intellectual property,leading this technology in China. TM245P series is the third generation of Neoden Tech’s desktop pick an
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
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