Technical Library | 2014-05-29 13:48:14.0
Electronics packaging based on stress-engineered spring interconnects has the potential to enable integrated IC testing, fine pitch, and compliance not readily available with other technologies. We describe new spring contacts which simultaneously achieve low resistance ( 30 μm) in dense 2-D arrays (180 ~ 180-µm pitch). Mechanical characterization shows that individual springs operate at approximately 150-µN force. Electrical measurements and simulations imply that the interface contact resistance contribution to a single contact resistance is This paper suggests that integrated testing and packaging can be performed with the springs, enabling new capabilities for markets such as multichip modules.
Industry News | 2017-11-08 07:18:03.0
XJTAG, a world leading supplier of boundary scan technology and Systech Europe, a leading European provider of electronic test solutions, today announced the availability of an integrated solution using XJTAG boundary scan and Takaya’s flying probe system.
Industry News | 2011-02-07 15:33:41.0
Multitest announces that Chris Cuda, US Product Manager, will present a paper titled "Benefits & Risks of High Aspect Ratio Vias in ATE Boards" at the upcoming Burn-in & Test Socket Workshop, scheduled to take place March 6-9, 2011 at the Hilton Phoenix East/Mesa Hotel in Mesa, Arizona.
Industry News | 2014-05-02 17:33:01.0
FCT Assembly today announced plans to exhibit at the SMTA Dallas and SMTA Houston Expos. The Oregon Expo & Tech Forum is scheduled to take place Wednesday May 7, 2014 at the Tektronix Building in Beaverton, OR, and the SMTA Atlanta 18th Annual Expo & Tech Forum, scheduled to take place Wednesday, May 7, 2014 at the Gwinnett Civic Center in Duluth, GA.
Industry News | 2011-04-07 20:23:54.0
Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.
Industry News | 2015-09-14 17:31:42.0
Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation are pleased to announce that their products will be featured in the SMTA International – National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience from Sept. 29-30, 2015 on the show floor of SMTAI. The experience is free to attend and is supported by CIRCUITS ASSEMBLY Magazine, SMTA and NPL.
Industry News | 2008-06-26 14:36:27.0
Building on its decades of materials deposition expertise, DEK has developed several unique advanced technology systems to enable next-generation semiconductor packaging and solar cell production processes. At the upcoming Semicon West event, scheduled for July 15 � 17 at San Francisco�s Moscone Center, DEK will display some of these latest innovations along with its new VectorGuard� Platinum stencil technology.
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Industry News | 2015-09-01 13:01:04.0
FCT Assembly (www.fctassembly.com), well-known in the electronics assembly industry for its Fine Line Stencil and FCT Solder divisions, will highlight its broad portfolio of products at SMTA International 2015 (www.smta.org/smtai/), as well as take part in the conference program and live process demonstrations on the show floor.
