Electronics Forum | Thu Sep 02 07:22:03 EDT 1999 | Earl Moon
| I'd like to know the advantages and disadvantages between the two. | | Thanks and regards, | | Both have their place. When using less fine pitch (.025" +) with fine pitch (.020" or less and BGA's) a .007" thick stencil may be used. This would re
Electronics Forum | Thu Dec 08 09:47:46 EST 2005 | slthomas
I'm with Grant on the .005" foil thickness. The key is to keep your aspect ratio (aperture width/foil thickness) over 1.5, laser cut, and I like trapezoidal aps. too.
Electronics Forum | Fri Feb 15 12:29:35 EST 2013 | mikesewell
What foil thickness? Type 3 or 4 paste? Have you checked your area ratio(s)? You could overprint or drop your foil thickness by one mil to improve the ratio and paste transfer. As always you can search the fine SMTnet archives for more info.
Electronics Forum | Thu Dec 08 12:24:11 EST 2005 | cyber_wolf
Any good stencil house should be able to recommend the proper configuration on a fine pitch aperture design. They can also advise you as to which foil thickness works best. The norm foil thickness is .005" - .006". There are always special instances
Electronics Forum | Mon Mar 15 10:08:25 EST 1999 | Justin Medernach
| Can sombody help me with this?? When applying solder paste, what factors determine how high off the PCB the stencil is? We use no fine pitch devices. (mostly 603 and 1206 size components) Any help would be greatly appreciated. As you could probably
Electronics Forum | Tue Mar 16 03:16:18 EST 1999 | Scott Davies
| | Can sombody help me with this?? When applying solder paste, what factors determine how high off the PCB the stencil is? We use no fine pitch devices. (mostly 603 and 1206 size components) Any help would be greatly appreciated. As you could probab
Electronics Forum | Thu Aug 16 19:56:38 EDT 2001 | davef
Awww, blank those fine tech support people at MPM. We know more than they do. Having said that, duh, umm er, please clarify the problem. * Are you concerned about paste squirting through the holes of the side 2 portion of the stencil when you are
Electronics Forum | Wed Jun 13 14:48:48 EDT 2007 | rgduval
Is there a sort of standard method to prevent part loss in reflow? I've had a couple of situations come up recently where we've lost some parts during second-side processing. We're running an Heller 1800, with a mesh belt. Most items process fine,
Electronics Forum | Fri Jan 24 08:14:24 EST 2014 | davem
m_imtiaz, Over the last 15 years or so I've found that using the stencil foil thickness +2mils/-0mils has worked very well. For example, if you have a 5mil stencil thickness your upper control limit would be 7mils and your lower control limit would
Electronics Forum | Fri Jan 24 09:52:08 EST 2014 | davem
Hi Guys, So I work for a small contract manufacturer which caters mainly to the defense sector. As such, our customers haven't (yet) had a great need to incorporate 01005's into their designs. Looking forward, we decided to "take the plunge" and dia
