Electronics Forum | Tue Jan 28 11:11:59 EST 2020 | spoiltforchoice
@Stephen The cost here is key, look what I pay for a foil, for established clients that's all I need charge for tooling a new prototype. I can build a pretty decent batch of prototype or low volume boards for less than some places charge for stencil
Electronics Forum | Mon Feb 21 17:56:44 EST 2005 | davef
You want approximately 5 particles minimum across the smallest aperture. So in the case of a 0.8mm device, we use .017" pads with a round 0.020" aperture on a 6 thou thick stencil foils. Here, 0.020" diameter equals 0.50mm. This gives us 0.50/5=10
Electronics Forum | Mon Jul 31 11:27:15 EDT 2006 | Chunks
I am printing convention leaded paste on onto Immersion Silver board. Board has 16mil fine pitch devices. I am having a problem getting the print to stick to board. Or I am having a problem with the stencil. Never experienced this with jobs befor
Electronics Forum | Fri Nov 24 10:03:08 EST 2006 | slthomas
"The fluid sometimes heats up to 105 deg F." Not sure what you mean here...is it set at 105 but rarely gets there, or is your temperature dependant upon another process to heat it up? Also, what temp is your rinse water? We used to use a U/S clean
Electronics Forum | Wed Nov 12 09:32:30 EST 2008 | markhoch
Are there better options? Dude, EVERYTHING else is a better option. Gluing aluminum foil down to the bare copper would be a better option. ENIG (Electroless Nickel Immersion Gold), Immersion Silver, Immersion Tin, and OSP all provide flatter surfac
Electronics Forum | Tue Apr 13 04:54:53 EDT 1999 | Charles Stringer
| | DOES ANY ONE KNOW HOW I CAN STRAIGHTEN | | BENT PINS ON A FINE PITCH QFP WITH OUT DAMAGING | | THE CHIP. AT $300 A CHIP I CAN'T SCRAP THEM. | | | I use tweezers and picks. I place the component down on it's backside (legs up) and manually twe
Electronics Forum | Tue Apr 13 12:36:57 EDT 1999 | Scott McKee
| | | DOES ANY ONE KNOW HOW I CAN STRAIGHTEN | | | BENT PINS ON A FINE PITCH QFP WITH OUT DAMAGING | | | THE CHIP. AT $300 A CHIP I CAN'T SCRAP THEM. | | | | | I use tweezers and picks. I place the component down on it's backside (legs up) and ma
Electronics Forum | Thu Jul 15 14:09:23 EDT 1999 | MMurphy
| | I use a Transition Automation Semi- Automatic stencil printer with laser cut frameless stencils. My solder paste is an SN63/PB37 RMA 291. I do not operate with in a controlled humidity enviroment. The room temp generally runs around 70 deg's but
Electronics Forum | Tue Jul 20 07:56:38 EDT 1999 | Mark Quealy
| | | I use a Transition Automation Semi- Automatic stencil printer with laser cut frameless stencils. My solder paste is an SN63/PB37 RMA 291. I do not operate with in a controlled humidity enviroment. The room temp generally runs around 70 deg's bu
Electronics Forum | Thu May 17 09:01:01 EDT 2012 | scottp
I'm not sure why anyone would pay extra for FG (fine grain) stencils. I've run studies comparing traditional YAG laser, fiber laser, and E-form stencils with regular stainless, FG, and nickel foils. YAG is the worse and should only be used for pret
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