Electronics Forum | Wed Aug 18 21:10:23 EDT 1999 | se
| | | Hi, | | | I'd like to ask some tips about the merits and shortcomings o | | | of both screen printer and stencil printer. For small quantity and highly mixed usage, which type of printer is suitable to our | | | application? | | | The board
Electronics Forum | Tue Aug 17 10:21:32 EDT 1999 | Steve A
It may be worth mentioning to those that do not have the ability to rotate the PCB, that some folks adjust their aperture design on fine pitch leads by increasing the aperture size for those leads parallel to the X axis, thus allowing consistent volu
Electronics Forum | Thu Jul 20 12:49:05 EDT 2000 | Bob Willis
So far on all my trials on PIHR I have only used standard products as the paste is defined by the printing requirements for fine pitch etc. As most people will have seen you just get a heap more residues with this process and even more with lead free
Electronics Forum | Thu Aug 26 14:45:09 EDT 1999 | Earl Moon
| What are the key steps to achieving high yield with CSP ??? | | (We are trying qualify vendors for volume fab/assembly of some | products which use several CSP devices on each side of the | board. (Some with 0.5mm ball pitch)) | | Looking throu
Electronics Forum | Sat Aug 14 01:21:29 EDT 1999 | Dean
| | Has anybody adopted the method of stencil printing with the board at a 45 degree angle to the squeegee blade? What are the benefits and drawbacks? I've heard you get better fine pitch results. | | | | TX | | Mark | | | I have used thetechni
Electronics Forum | Sun Jun 20 16:58:31 EDT 1999 | Chrys Shea
| Has there anyone bold enough to try this in their shops? My cubemate just got through telling me that at his last shop, they had bare copper boards (no HASL, no OSP, no nothing), with minimal solderability problems. | Is your cubemate the same gu
Electronics Forum | Thu Oct 08 22:32:58 EDT 1998 | Dave F
| | | | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the re
Electronics Forum | Tue Aug 25 08:51:16 EDT 1998 | Justin Medernach
| | | Hi, | | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | | We have rule out the possibility of not printing any
Electronics Forum | Mon Nov 12 16:14:47 EST 2001 | davef
Yes!!! How can we assemble boards with 20 pitch when we allow 0.008� error to the master art? Excellent question!!! IPC-D-300G has nothing to do with assembler requirements. It is written by and for fabricators, so that they can be comfortable.
Electronics Forum | Tue Nov 27 08:47:24 EST 2007 | ratsalad
The letter below was dated December 13, 2006 from Kester's Senior Market Development Engineer. I guess since then they have moved production back to Mexico. We no longer use EM907 as our primary Pb-free paste so I haven't seen any containers in a w
