Industry News | 2013-11-14 18:14:55.0
Indium Corporation was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in Münich, Germany on November 12.
Industry News | 2015-10-27 22:36:45.0
Speedline Technologies announces the introduction of MPM Edison, the next generation in printing technology. Edison is an innovative new platform of next-generation printers sharing software, controls, and advanced technologies on a scalable platform.
Industry News | 2001-05-21 13:24:29.0
Uses less chemistry, generates less wastewater and cleans solder paste, adhesives and flux residue in one system!
Industry News | 2005-12-15 11:50:05.0
Best Cleaning Material
Industry News | 2009-03-02 00:28:54.0
DEK has announced the launch of its VectorGuard� Platinum stencil technology. Now available for DEK customers in Asia, Europe and the Americas, the new technology provides semiconductor manufacturers with an ideal solution for a diverse range of next-generation challenges.
http://www.flason-smt.com/product/SMT-Online-AOI-Machine.html SMT Online AOI Machine ZW 810 Inspection Component: 0201 chip PCB size::25x25-480*330mm Dimension:900*950*1600 mm Weight: 650kg Product description: SMT Online AOI Machine ZW 810, I
Industry News | 2020-12-03 13:07:26.0
Indium Corporation's newest jetting and microdispensing solder paste, Indium12.8HF, has been officially recommended by NSWAutomation for use with their newest microfluid dispenser, SD1.
Industry News | 2023-09-25 20:04:34.0
Indium Corporation® will proudly feature an array of innovative materials solutions for thermal management and advanced packaging applications at the IMAPS International Symposium on Microelectronics, October 3-4, in San Diego, California.
Industry News | 2006-04-24 15:56:46.0
One need only see a quick demonstration of DEK�s new HawkEye� post-print verification technology to understand why it continues to gain widespread acceptance and win global industry accolades. Visitors to the DEK booth at Nepcon East this year will have such an opportunity.
Industry News | 2011-01-18 13:46:21.0
Time and again, a major challenge lies in attaching integrated circuits (ICs) to highly integrated circuit board substrates in a space-saving manner. Würth Elektronik took this challenge on and found an ideal solution with the ESC (encapsulated solder connection) process. The chips are soldered and at the same time glued 'face-down" in their exact position.
