Used SMT Equipment | Pick and Place/Feeders
Model: CP45F-NEO Mounting speed:14,900CPH(IPC9850) Component recognition range:1005(0402)～□22mmIC 0603(0201) ～ □12mm(option) Placement accuracy:±0.08mm PCB SIZE: 50×30×0.3～460&
Used SMT Equipment | Pick and Place/Feeders
Model: CP45FV-NEO Mounting speed:14,900CPH(IPC9850) Component recognition range:1005(0402)～□32mmIC 0603(0201) ～□42mm(option) Placement accuracy:±0.08mm/CHIP;±0.04mm/CFP PCB SIZE: 50
Industry News | 2022-11-15 12:33:16.0
SHENMAO America, Inc is pleased to introduce its newest offering: PF735-EP307 Joint Enhanced Solder Paste (JEP). The new low melting point epoxy-based solder material has been developed for extremely fine-pitch or fine pad soldering, especially advanced display assembly.
Used SMT Equipment | Pick and Place/Feeders
Quad Pick & Place Model: QSX-1 Serial Number: 3376 Quad QSX-1 Pick and Place System Features: Dual gantry design provides placement rates up to 7,000 cph takt time Handles board sizes from 3.2" x 3" to 19.3" x 25" In-process QuadAlign touch
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Used SMT Equipment | Pick and Place/Feeders
Universal GSM2 Placement Machine With PTF For Sale High Volume, Fine Pitch Placement Design Precision Linear Scales Brushless DC Motors On-The-Fly Vision System Graphical Interface with an On-Line Component Database CAD Transla
Used SMT Equipment | SMD Placement Machines
Save $$$ on our like new Mirae MR40L demo unit from our Demo room. This unit lists for $194,500, but this demo unit is sale priced for only $85,000! This machine is designed for any size manufacturer with higher speed requirements; it has dual gantry
New Equipment | Selective Soldering
The L-CAT NEO can be designed for either a stand alone or in-line soldering process. This next generation soldering robot will communicate with computer and smart devices for easy management. This is the next generation robot which has all the funct
Industry News | 2019-11-05 22:08:21.0
Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.
Industry News | 2020-12-18 19:19:05.0
MacDermid Alpha Electronics Solutions is pleased to launch ALPHA® OM-372, an ultra-fine feature, lead-free, no-clean solder paste designed to provide ultra-high electrochemical reliability on fine pitched, low standoff components.
The objective of this course is to identify the technical issues in Through hole, SMT, BGA and fine pitch technology design and manufacturing that must be resolved for an effective implementation of mixed assembly electronics products. The course mat
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