3D in-line SPI System Volume, Height, Area, Bridge, Offset Laser Triangulation method is applied which least affected by environmental factors. Highest inspection speed and accuracy by 3D sensor head with DSP chip Real-time SPC analys
Used SMT Equipment | Pick and Place/Feeders
PROTOPLACE S - SEMI-AUTOMATIC SMT ASSEMBLY SYSTEM DESCRIPTION: SMT Pick & Place of PCB Prototypes The LPKF ProtoPlace S is an ergonomically designed, semi-automatic pick & place system for the professional assembly of SMT printed circuit board protot
Industry News | 2013-02-04 14:14:48.0
Practical Components and its sister company Practical Tools will exhibit in booth A16 at the upcoming IPC APEX Expo
New Equipment | Education/Training
Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for
The Sniper SMD-7007 combines the reflow operation of the Flo-master with the latest technology in optic and alignment design. It provides absolute control in positioning all ultra fine pitch QFP, CSP, BGA, uBGA, Large Ceramic or plastic BGA devices
Industry Directory | Manufacturer
Manufacturer of materials for the electronics assembly marketplace. Our RoHS-compliant products include solder pastes, fluxes, solder powder, core wire and bar solder and process support products.
Industry News | 2005-09-23 13:31:20.0
The SP200-AVC from ESSEMTEC is a new stencil printer for fully automatic SMT assembly lines. The unique trans-stencil vision system, the integrated stencil cleaner and the continuous squeegee pressure regulation provide highest precision and reliability. The printer is designed for quick setup and changeover.
Industry News | 2013-04-11 18:53:28.0
Multitest, will present at the Teradyne Users Group Conference, scheduled to take place April 29-May 1, 2013 in Fort Worth, TX. Meet Multitest’s experts to learn more about the company’s solutions, from wafer-level test to final test – for standard ICs and sensor packages.
Technical Library | 2006-10-02 14:26:47.0
This paper addresses the assembly and reliability of 0.5 mm pitch leadless Chip Scale Packages (CSP) on .062" immersion Ag plated printed circuit boards (PCB) using Pb-free solder paste. Four different leadless CSP designs were studied and each was evaluated using multiple PCB attachment pad designs.
Industry News | 2013-03-28 11:03:15.0
Multitest, will present at the VOICE conference, scheduled to take place April 23-25, 2013 at the DoubleTree by Hilton Hotel in San Jose, CA. Meet Multitest’s experts to learn more about the company’s solutions, from wafer-level test to final test – for standard ICs and sensor packages.
