Technical Library | 2020-07-15 18:29:34.0
In the early 2000s the first fine-pitch ball grid array devices became popular with designers looking to pack as much horsepower into as small a space as possible. "Smaller is better" became the rule and with that the mechanical drilling world became severely impacted by available drill bit sizes, aspect ratios, and plating methodologies. First of all, the diameter of the drill needed to be in the 0.006" or smaller range due to the reduction of pad size and spacing pitch. Secondly, the aspect ratio (depth to diameter) became limited by drill flute length, positional accuracy, rigidity of the tools (to prevent breakage), and the throwing power of acid copper plating systems. And lastly, the plating needed to close up the hole as much as possible, which led to problems with voiding, incomplete fill, and gas/solution entrapment.
H610 with automatic recognition function of machine vision, using high-precision Servo drive system to achieve fast and accuracy alignment .It build in independent cleaning system, the cycle time less than 7s,ensure the high printing quality of solde
H450 with automatic recognition function of machine vision, using high-precision Servo drive system to achieve fast and accuracy alignment .The precision can reach +/- 0.01mm.It build in independent cleaning system, the cycle time less than7s,ensure
Fully-automatic screen printer H1500 with automatic recognition function of machine vision, using high-precision servo drive system to achieve fast and accuracy alignment .It build in independent cleaning system, the cycle time less than 10s,ensure t
Technical Library | 2015-12-02 18:32:50.0
(Thermal Compression with Non-Conductive Paste Underfill) Method.The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar micro-bump and TCNCP is one of the platform technologies, which is essentially required for 2.5D/3D chip stacking as well as cost effective SFF (small form factor) package enablement.Although the baseline packaging process methodology for a normal pad pitch (i.e. inline 50μm) within smaller chip size (i.e. 100 mm2) has been established and are in use for HVM production, there are several challenges to be addressed for further development for commercialization of finer bump pitch with larger die (i.e. ≤50μm tri-tier bond pad with the die larger than 400mm2).This paper will address the key challenges of each field, such as the Cu trace design on a substrate for robust micro-joint reliability, TCNCP technology, and substrate technology (i.e. structure, surface finish). Technical recommendations based on the lessons learned from a series of process experimentation will be provided, as well. Finally, this technology has been used for the successful launching of the company FPGA products with SFF packaging technology.
Quick Overview 1Clicksmt 's H450 with automatic recognition function of machine vision, using high-precision Servo drive system to achieve fast and accuracy alignment .The precision can reach +/- 0.01mm.It build in independent cleaning system, the c
Quick Overview: Fully-automatic screen printer H1200 with automatic recognition function of machine vision, using high-precision servo drive system to achieve fast and accuracy alignment .The precision can reach +/- 0.01mm.It build in independent cl
Industry Directory | Manufacturer
We offer complete PCB assembly including SMT, BGA, Fine Pitch, High Density and Through Hole. This is complimented by our Electro-Mechanical design & assembly department. We provide a High Level of Quality and Service from quote to finished product.
HTC-300 is designed for screen printing in flex circuit and printed electronic applications where stable resistance values at elevated temperatures are required. Utilizes a high Tg (glass transition temperature) thermoplastic copolymer binder fo
New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
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