New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
New Equipment | Cleaning Equipment
Evaporative Cooling Pad With the support from our meticulous workforce, we are introducing an extensive array of Evaporative Cooling Pad. The offered product is manufactured using superior quality basic material and advanced technology with the set i
New Equipment | Rework & Repair Equipment
Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,
New Equipment | Rework & Repair Equipment
Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,
Welcome to the next generation in PWB test solutions. We combine an exceptional team of technology and applications experts with HIOKI's industry-leading systems to enhance your reliability and to speed up your product development process.
New Equipment | Design Services
PNC Inc. provides PCB design services from Schematic, Sample PCB or films. We provide reverse engineering services with PCB Design and full Gerber Data generation from your sample. Capabilities Double Sided & Multi layer Designs Radial Layouts a
Technical Library | 2015-12-31 15:19:28.0
Today's consumer electronic product are characterized by miniatuization, portability and light weight with high performance, especially for 3G mobile products. In the future more fine pitch CSPs (0.4mm) component will be required. However, the product reliability has been a big challenge with the fine pitch CSP. Firstly, the fine pitch CSPs are with smaller solder balls of 0.25mm diameter or even smaller. The small solder ball and pad size do weaken the solder connection and the adhesion of the pad and substrate, thus the pad will peel off easily from the PCB substrate. In addition, miniature solder joint reduce the strength during mechanical vibration, thermal shock, fatigue failure, etc. Secondly, applying sufficient solder paste evenly on the small pad of the CSP is difficult because stencil opening is only 0.25mm or less. This issue can be solved using the high end type of stencil such as Electroforming which will increase the cost.
H610 with automatic recognition function of machine vision, using high-precision Servo drive system to achieve fast and accuracy alignment .It build in independent cleaning system, the cycle time less than 7s,ensure the high printing quality of solde
Industry Directory | Consultant / Service Provider / Manufacturer
Quick Turn Prototype to Med. Vol. SMT assembly, including Fine Pitch, and BGA. Onsite Engineering.
Producing the highest quality Flying Probe with integrated or stand-alone Boundary Scan test programs since 2005, Test Coach is the proven specialist firm for flying probe test. Over 15 years of honed flying probe test techniques guarantees that our
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