Industry Directory | Manufacturer
pcb construction@testing using surface mount and through hole components.
Parts & Supplies | SMT Equipment
OEM Part, Tested in an MTU4R on a Fuji IP 3 Fine Pitch Placer, no production use. FOB: Edina, MN 55439 Contact: AssuredTech@yahoo.com
Used SMT Equipment | Flexible Mounters
Operational Fuji IP-III Fine Pitch placer with 2048 camera on tray tower side. Lots of feeders. Can be purchased separately or as part of a running prototype line with CP-4 and OmniFlo 7 oven and conveyors. Fuji Flexa program modules included.
Used SMT Equipment | Pick and Place/Feeders
MG1 machine with ITF FES interface. In excellent condition The MG1 delivers a perfect balance between high mix and high accuracy. Placement capabilities range from 01005 and large, fine pitch QFP's to tall components and odd form parts chip
Used SMT Equipment | AOI / Automated Optical Inspection
Description: Hello and thank you for your interest in our MVP AOI Machines For Sale.We have a total of (2)Ultra 18-20 MVP Automated Optical Inspection Machines,(1)CentOS based server. They were taken off line due to new machine installation would
Used SMT Equipment | AOI / Automated Optical Inspection
Inspects down to 0402 for parts/solder checks Fine pitch QFP's and TSOPS Board Size: 2.5" x 2.5" Minimum / 12" x 12" maximum Capable of checking for missing part, solder quality, electrode lead co
Industry Directory | Consultant / Service Provider / Manufacturer
One of the major suppliers of stencils and pallets to the SMT industry. Stentech offers Electroformed and laser cut stencils, pallets and fixtures.
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
The objective of this course is to identify the technical issues in Through hole, SMT, BGA and fine pitch technology design and manufacturing that must be resolved for an effective implementation of mixed assembly electronics products. The course mat
