Full Site - : finetech rework (Page 9 of 23)

Finetech Sells 12 Bonding Systems to University Labs to Advance Research

Industry News | 2011-06-01 23:22:00.0

Finetech announces that it sold 12 bonding systems within the past year to prominent university labs and research centers. Of the 12, three systems were purchased by California universities, including a Nanofabrication Facility as well as Electrical Engineering and Physics departments.

Finetech

MARTIN Launches Web Site for North American Market

Industry News | 2011-04-07 20:58:45.0

MARTIN announces the launch of its new North American Web site. The new easy-to-navigate site, located at www.bgarework.com, highlights the company’s rework and dispensing products available in North America.

MARTIN (a Finetech company)

High Accuracy Die Bonder on Display at SPIE Photonics West 2010

Industry News | 2010-01-07 20:09:26.0

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 1026 at the upcoming SPIE Photonics West exhibition, scheduled for January 23-28, 2010 at the Moscone Center in San Francisco, CA.

Finetech

MARTIN to Demonstrate Standalone BGA Reball and QFN Solder Bumping Unit at SMTA Upper Midwest

Industry News | 2010-05-29 18:57:32.0

MARTIN will demonstrate the Reball/Prebump 03.1 unit at the upcoming SMTA Upper Midwest Expo, scheduled to take place Wednesday, June 9, 2010, at the Sheraton Bloomington Hotel in Bloomington, MN. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.

Finetech

MARTIN to Demonstrate Standalone BGA Reball and QFN Solder Bumping Unit at SMTA Ohio Valley Expo & Tech Forum

Industry News | 2010-06-30 12:09:49.0

MARTIN will demonstrate the Reball / Prebump 03.1 unit at the upcoming SMTA Ohio Valley Expo & Tech Forum, scheduled for Wednesday, July 14, 2010 at the Doubletree Hotel in Cleveland, OH. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.

Finetech

MARTIN to Demonstrate Standalone QFN Solder Bumping and BGA Reball Unit at SMTA Capital Expo

Industry News | 2010-09-15 21:55:19.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Capital Expo and Tech Forum, scheduled to take place Tuesday, September 21, 2010 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD.

Finetech

MARTIN to Demonstrate Stand Alone QFN Solder Bumping and BGA Reball Unit at the CTEA Austin Expo & Tech Forum

Industry News | 2010-10-04 15:37:18.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming Central Texas Electronics Association (SMTA/IMAPS) Expo & Tech Forum, scheduled to take place, October 7, 2010 at the Norris Conference Centers in Austin, TX.

Finetech

MARTIN to Demonstrate Stand Alone QFN Solder Bumping and BGA Reball Unit at the SMTA Arizona-Sonora Expo & Tech Forum

Industry News | 2010-11-18 11:04:08.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Arizona-Sonora Expo & Tech Forum, scheduled to take place Wednesday, December 1, 2010 at the Fiesta Inn Resort & Conference Center in Tempe, AZ.

Finetech

MARTIN to Demonstrate BGA Reball/Pre-Bump Unit at the SMTA Space Coast Expo & Tech Forum

Industry News | 2011-05-10 19:11:40.0

MARTIN will showcase its Mini-Oven 04 Reball/Prebump unit at the upcoming Space Coast Expo and Tech Forum, scheduled to take place June 9, 2011 at the Melbourne Auditorium in Melbourne, FL.

MARTIN (a Finetech company)

Finetech Unveils High Force ACF Bonder

Industry News | 2013-11-08 18:07:48.0

Finetech has developed a new high force configuration of the FINEPLACER® pico ma platform targeting leading-edge anisotropic conductive film (ACF) applications.

Finetech


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